Wafer transferring equipment

A technology for conveying equipment and wafers, applied to lighting and heating equipment, conveyor objects, furnaces, etc., can solve problems such as unfavorable production efficiency, repeated investment and waste of space equipment, and increased wafer fragments

Inactive Publication Date: 2004-07-28
D TEK TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The conventional technology uses manual or automatic handling devices to carry the wafer boat box with one or more wafers, and when it is transferred to each device, a step of loading / unloading wafers is required, which causes waste of process time and many Steps increase the probability of wafer fragmentation, which is not conducive to production efficiency
On the other hand, separate and independent devices also cause waste of space and repeated investment in equipment

Method used

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Examples

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no. 1 example

[0029] refer to figure 2 , a first embodiment of a wafer transfer apparatus of the present invention will be described. like figure 2 As shown, the wafer transfer equipment 21 is used to include: at least one crystal boat box 20, a flux coating unit 22, a ball planting unit 23, a detection unit 24, a reflow unit 25, and a load-out unit 26 Wafer ball placement equipment 2. The wafer transfer device 21 further includes a robot arm 211 and a stage 212 .

[0030] The at least one boat box 20 is used to carry one or more wafers. The at least one wafer pod 20 is loaded into the wafer transfer device 21 . By the mechanical arm 211 of the wafer transfer device 21, a wafer is taken out from the at least one wafer box 20, and sent to the flux coating unit 22, where after flux coating is completed, the The robot arm 211 transfers the wafer to the ball planting unit 23 , and after the ball planting is completed, the robot arm 211 still uses the robot arm 211 to transfer the wafer t...

no. 2 example

[0033] refer to image 3 , a second embodiment of a wafer transfer apparatus of the present invention is described. like image 3 As shown, the wafer transfer equipment 21 is used in the wafer ball planting equipment 3 including at least one wafer boat box 20 , a printing unit 32 , a testing unit 24 , a reflow unit 25 , and a loading unit 26 . The wafer transfer device 21 further includes a robot arm 211 and a stage 212 .

[0034] The at least one boat box 20 is used to carry one or more wafers. The at least one wafer pod 20 is loaded into the wafer transfer device 21 . By the robotic arm 211 of the wafer transfer device 21, a wafer is taken out from the at least one crystal boat box 20, and sent to the printing unit 32, where after the solder paste printing is completed, the robotic arm 211 will still The wafer is transferred to the inspection unit 24 . At this time, when the inspection unit 24 determines that it is a good product, the chip is sent to the reflow unit 25 ...

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PUM

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Abstract

The present invention discloses a wafer transfer equipment. It can be used in the wafer ball-planting equipment having at least one crystal boat box, soldering flux coating unit, ball-planting unit, reflow soldering unit and carryover unit or used in the wafer ball-printing equipment having at least one crystal boat box, printing equipment, reflox soldering unit and carryover. The wafer transfer equipment includes a mechanical arm which is used for taking out wafer from at least crystal boat box and for transferring the wafer into any of crystal boad, soldering flux coating unit, ball-planting unit or printing equipment and reflow soldering unit or transferring the wafer out from any of them. The wafer transfer equipment also has a carrying table for loading mechanical arm.

Description

technical field [0001] The invention relates to a wafer conveying equipment, in particular to a wafer ball planting / ball printing equipment, so as to simplify the conveying device and the conveying method in the production process. Specifically, it can reduce the time of the wafer planting / ball printing process, and reduce the probability of chip breakage of the wafer during the transfer process by simplifying the transfer steps of the wafer, so as to achieve the purpose of improving production efficiency, and at the same time meet the requirements of saving space and equipment requirements. Background technique [0002] In the semiconductor manufacturing process, the chip welding bump production process includes the following two: one is to apply flux on a chip first, then place the solder balls on the chip, and then form a soldering process by heating and re-soldering Bumps are placed on the chip; the second is to print solder paste on a chip, and then form soldering bump...

Claims

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Application Information

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IPC IPC(8): B65G49/07
Inventor 费耀祺陈昶华郑智贤沈基盟
Owner D TEK TECHNOLOGY CO LTD
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