High-efficiency high-brightness multiple active district tunnel reclaimed white light light emitting diodes
A light-emitting diode, high-brightness technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low absorption rate of phosphor powder, short life of phosphor powder, low color rendering index, etc., and achieve high luminous efficiency and improved quantum efficiency , Chroma realistic effect
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Embodiment 1
[0036] Such as Figure 7 Shown, its preparation process and method are as follows:
[0037] 1. Use common MOVCD method in N + - On the GaAs substrate, epitaxially grow N++GaAs / P++GaAs tunnel junction 9, N-GaInP transition layer 7, N-AlInP lower confinement layer 6, AlGaInP / GaInP heterojunction light-emitting region 5, and P-AlInP top Confinement layer 4, p+GaAs contact layer 2. Then, the red light-emitting unit 14 is obtained by evaporating or sputtering the p-type metal electrode Ti / Au (1) on the front side, and then removing the substrate GaAs through a grinding and thinning process;
[0038]2. On the sapphire or SiC substrate, grow n-GaN transition layer 7, n-InGaN lower confinement layer 6, InGaN / GaN multi-quantum well blue light emitting region 11, p-AlGaN upper confinement layer 4, AlInN / GaN DBR Blue light reflection layer 3, n++InGaN / P++GaN tunnel junction 9, n-GaN transition layer 7, n-InGaN lower confinement layer 6, InGaN / GaN multi-quantum well green light emittin...
Embodiment 2
[0041] Such as Figure 8 Shown, its preparation process and method are as follows:
[0042] 1. Use common MOVCD method in N + - On the GaAs substrate, epitaxially grow N++GaAs / P++GaAs tunnel junction 9, N-GaInP transition layer 7, N-AlInP lower confinement layer 8, AlGaInP / GaInP heterojunction light-emitting region 5, and P-AlInP top Confinement layer 4, p+GaAs contact layer 2. Then, the red light-emitting unit 14 is obtained by evaporating or sputtering the p-type metal electrode Ti / Au (1) on the front side, and then removing the substrate GaAs through a grinding and thinning process;
[0043] 2. On a sapphire or SiC substrate, grow n-GaN buffer layer 7, n-InGaN lower confinement layer 6, InGaN / GaN multi-quantum well blue-green light-emitting region 18, p-AlGaN upper confinement layer 4, AlInN / GaN DBR blue light reflection layer 3, P++GaN contact layer 2, evaporate n-type electrode 13 after photolithography and etching to form a combination of blue and green light emittin...
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