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Novel poyimide copolymer

A polyimide and copolymer technology, applied in the new polyimide copolymer field, can solve the problems of high adhesive force, unable to meet the expected thermal resistance steric stability, etc.

Inactive Publication Date: 2003-10-08
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] A polyimide copolymer based on 3,3',4,4'-benzophenonetetracarboxylic dianhydride-6-amino-2-(p-aminophenyl)benzoimidazole has been approved by the present application Human recommendation (WO 01 / 29136), wherein isopropylidene bis(4-phenylene amino-4-phthalic acid) dianhydride and 3,3',4,4'-benzophenone tetracarboxylic acid Used together with dianhydride, the polyimide copolymer produced by polycondensation of these three components has high adhesion itself, and can produce a metal laminate, which can be used even without any adhesive layer. In the case of bonding with metal foil, it can also have good peel strength. In addition, the copolymer also has satisfactory soldering thermal resistance, but it cannot meet the desired thermal resistance space stability.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Will contain 2.18g (0.01mole) (A) pyromellitic dianhydride, 29.00g (0.09moles) (B) 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 300ml N -Methylpyrrolidone was charged into a four-necked flask with a volume of 1 liter under nitrogen atmosphere and stirring, and then 22.43 g (0.1 moles) of (C) 6-amino-2- (p-Aminophenyl)benzomisazole was added thereto. This mixture was stirred at room temperature for 3 hours to obtain 353.6 g of a polyimide precursor copolymer (polyamic acid) solution (solid concentration: 15 wt. %; viscosity at 20° C.: 7020 cps).

[0020] The polyamic acid solution was cast onto a rust-free steel plate to a desired thickness, and then dried at a temperature of 140°C for 5 minutes. Next, the produced film was peeled off from the stainless steel plate, and then heated at a temperature of 390° C. for 3 minutes to obtain a polyimide copolymer film.

Embodiment 2

[0022] According to the method in Example 1, the addition of (A) component and (B) component is changed into 10.91g (0.05moles) and 16.11g (0.05moles) respectively, obtains 349.5g (solid concentration: 15wt.%; at 20 Viscosity at °C: 6,950 cps) polyamic acid solution, in the same manner as in Example 1, to obtain a polyimide copolymer film.

Embodiment 3

[0024] According to the method in Example 1, the addition of (A) component and (B) component is changed into 15.27g (0.07moles) and 9.67g (0.03moles) respectively, obtains 347.4g (solid concentration: 15wt.%; Viscosity at °C: 6,830 cps) polyamic acid solution, with the same method as in Example 1 to obtain a polyimide copolymer film.

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PUM

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Abstract

A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3 ' ,4,4 ' -benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.

Description

1. Field of invention [0001] The present invention relates to a new polyimide copolymer, and more particularly, relates to a new polyimide copolymer with significant thermal resistance steric stability. 2. Technical Background [0002] As we all know, the existing polyimide resin has obvious characteristics, such as excellent heat resistance, electrical characteristics and mechanical characteristics, but generally also suffers from high linear expansion coefficient, high humidity expansion coefficient, and poor dimensional stability . In particular, when the coefficient of linear expansion is not less than 30ppm / °C, the polyimide resin will have poor thermal resistance steric stability, thus causing problems such as the following, that is, when it is laminated with metal foil Bending and crimping will occur when making a flexible wiring substrate. [0003] In order to solve the above problems, it has been proposed to use a polyimide film, which can be prepared, for example...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B29C41/08B29K79/00B29L7/00C08G73/10
CPCC08G73/1042C08G73/1085C08G73/1082Y10T428/31678Y10T428/31681Y10T428/31721C08G73/10
Inventor 左敏林正添
Owner NIPPON MEKTRON LTD
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