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Sealing structure of liquid-crystal displaying panel and producing process thereof

A liquid crystal display panel and packaging structure technology, which is applied in the direction of identification devices, static indicators, semiconductor/solid-state device manufacturing, etc., can solve the problems of increased cost of liquid crystal display panels, increased manufacturing process time, and high price of anisotropic conductive films. , to achieve the effect of shortening the manufacturing process time and reducing the cost of materials

Inactive Publication Date: 2007-07-11
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] 1. Because two different anisotropic conductive films are used, two attachment steps are required in the packaging process, which will increase the production process time and lead to a decrease in production capacity
[0008] 2. Because the anisotropic conductive film is expensive, using two different anisotropic conductive films will increase the cost of each LCD panel

Method used

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  • Sealing structure of liquid-crystal displaying panel and producing process thereof
  • Sealing structure of liquid-crystal displaying panel and producing process thereof
  • Sealing structure of liquid-crystal displaying panel and producing process thereof

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Embodiment Construction

[0035] FIG. 3 shows a flow chart of the packaging of a liquid crystal display panel according to a preferred embodiment of the present invention. 3, the packaging process of the liquid crystal display panel of the present invention first provides a liquid crystal display panel (S20), the liquid crystal display panel has a display area and a non-display area, wherein the non-display area has a driving chip pressing area And a flexible circuit film pressing area, and there are lines on the non-display area, these lines are used to connect the display area, the driving chip pressing area and the flexible circuit film pressing area; then a shared anisotropic conductive film Attachment (S22). In this step, the shared anisotropic conductive film is attached to the driver chip pressing area and the flexible circuit film pressing area; then a driver chip is pressed at high temperature on the shared anisotropic conductive film On the conductive film (S24), the bumps on the driver chip and ...

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Abstract

In the present invention, a shared type of heterodirectivity conduction film is snuggled up to nondisplaying area of liquid crystal display panel so driving chip and soft circuit film set on shared type of heterodirectivity conduction film are electric-connected with circuit on non displaying area; thus only one step of snuggling is required in packaging procedure since shard type of heterodirectivity conduction film provided by the present invention is applied.

Description

Technical field [0001] The present invention relates to a packaging structure of a liquid crystal display panel (LCD panel) and a manufacturing process thereof, and in particular to a packaging structure of a liquid crystal display panel using a shared anisotropic conductive film and a manufacturing process thereof. Background technique [0002] With the rapid development of liquid crystal display technology, the new generation of liquid crystal displays is developing in the direction of high brightness, wide viewing angle, fast response rate, high image resolution and full color. However, factors that affect these image characteristics include the structure of the liquid crystal molecules, the physical properties of the pixel electrode, the color filter, the manufacturing process of the thin film transistor, the alignment layer, the sealant material, and the backend construction technology, etc. Due to the demand for high image resolution of LCD displays and the miniaturiz...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1339G02F1/133H01L21/3205G09F9/35
Inventor 冯绪文孙坚
Owner AU OPTRONICS CORP
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