Manufacturing method of copper-embedded circuit board

Abstract

The invention provides a manufacturing method of a copper-embedded circuit board, which comprises the following steps of: etching: carrying out region division on a copper plate, marking a copper block embedding region on a region which does not need to be etched, and etching the region, except the copper block embedding region, on the copper plate to obtain a plurality of pieces of convex copper corresponding to the copper block embedding region and a copper bottom plate connected with the plurality of pieces of convex copper; grooving: forming first grooves corresponding to the convex copper parts in position on the middle dielectric layer; pressing: sequentially pressing the single-sided copper foil, the middle dielectric layer and the etched copper plate together, and embedding the plurality of convex copper into the position of the first slot; and re-etching: etching the single-sided copper foil and the copper bottom plate respectively to completely remove the single-sided copper foil and the copper bottom plate so as to obtain the copper-embedded circuit board. According to the manufacturing method of the copper-embedded circuit board provided by the invention, a plurality of copper blocks with different shapes and different sizes can be embedded at one time, and meanwhile, the embedding positions of the copper blocks are ensured to be accurate and other risks of missing placement and falling are avoided.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a buried copper circuit board. Background technique [0002] At present, for burying copper blocks with a size below 10*10mm, the existing technology mostly adopts manual placement, that is, manually burying the copper blocks in the pre-etched copper block grooves, and then pressing them together. [0003] However, in practice, it is found that most of the existing methods for making buried copper circuit boards have the following problems: [0004] 1. The operation of manually placing copper blocks is slow, especially when dozens or even hundreds of copper blocks need to be placed in the circuit board, it takes a lot of manpower and time, which greatly affects the work efficiency of buried copper circuit board production; 2. It is impossible to Effectively prevent the risk of leakage; 3. After the copper block is placed in the copper block slot,...

AI Technical Summary

Problems solved by technology

[0004] 1. The operation of manually placing copper blocks is slow, especially when dozens or even hundreds of copper blocks need to be placed in the circuit board, it takes a lot of manpower and time, which greatly affects the work efficiency of buried copper circuit boards; 2. It is impossible Effectively prevent the risk of leakage; 3. After the copper block is placed in the copper block slot, other actions will occur, such as the risk of leakage or displacement during the stacking or plate transfer process; 4. Like a circuit board with different shapes, When embedding copper blocks of different sizes, manual operation will be more error-prone

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