Baking device for processing and uniformly baking substrate

A substrate, uniform technology, applied in the direction of electric heating devices, furnaces, furnace heating elements, etc., can solve the problems of uneven temperature, not being maintained, etc.

Pending Publication Date: 2022-07-29
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, when placed on a heated substrate support such as a vacuum chuck, electrostatic chuck, or other substrate support operable to retain and heat a substrate via a heating element disposed therein, the substrate's Edges may not be held on the heated substrate support, resulting in uneven temperatures across the substrate surface

Method used

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  • Baking device for processing and uniformly baking substrate
  • Baking device for processing and uniformly baking substrate
  • Baking device for processing and uniformly baking substrate

Examples

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Embodiment Construction

[0020] Embodiments of the present disclosure generally relate to bake apparatus and methods for handling and uniformly baking substrates. These bake apparatuses allow the substrate to be heated to temperatures greater than 50°C without a bend of about 1 mm to about 2 mm from the edge of the substrate to the center of the substrate. These bake apparatuses heat the substrate uniformly or substantially uniformly to improve the quality of the substrate.

[0021] Figure 1A and 1B is a schematic cross-sectional view of the baking apparatus 100 . Baking apparatus 100 includes base 102 , lid 104 and substrate hold assembly 112 . The substrate support assembly 112 includes two or more shafts 114 having one or more extensions 116 coupled to the two or more shafts 114 . The shafts 114 each have a shaft height 115 . In one embodiment, which may be combined with other embodiments described herein, the shaft height is between about 0.5 inches and about 5 inches.

[0022] The one or m...

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Abstract

Embodiments of the present disclosure relate to a baking apparatus for disposing and uniformly baking a substrate and a method for disposing and uniformly baking a substrate. The baking apparatus allows the substrate to be heated to a temperature greater than 50 DEG C without a bend of about 1 mm to about 2 mm from an edge of the substrate to a center of the substrate. The baking apparatus uniformly or substantially uniformly heats a substrate to improve substrate quality.

Description

[0001] background technical field [0002] Embodiments of the present disclosure generally relate to baking apparatus and methods for handling and uniformly baking substrates. Background technique [0003] In the manufacture of optical devices, the substrate may be heated to a temperature greater than 50 degrees Celsius (°C), such as from about 50°C to about 300°C. A substrate, such as a glass substrate, may include one or more materials that allow the substrate to bend at temperatures greater than 50°C. The one or more materials may be materials with an index of refraction greater than 1.5. A substrate having an index of refraction greater than 1.5 when heated to a temperature greater than 50°C may have a bowing of about 1 millimeter (mm) to about 2 mm from the edge of the substrate to the center of the substrate. Thus, when disposed on a heated substrate support, such as a vacuum chuck, electrostatic chuck, or other substrate support operable to retain the substrate and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687H01L21/027G03F7/38G03F7/40
CPCF27D5/00H05B3/283F27B17/0025F27D5/0037H01L21/67H05B3/62H05B3/748
Inventor 希拉姆·塞维拉徐永安卢多维克·戈代
Owner APPLIED MATERIALS INC
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