Grinding machine pollution discharge waste liquid separation treatment method

A waste liquid separation and grinding machine technology, which is applied in separation methods, sludge treatment, water/sewage treatment, etc., can solve the problem of low COD removal

Pending Publication Date: 2022-06-14
上海中欣晶圆半导体科技有限公司
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  • Description
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Problems solved by technology

[0002] Grinding machine sewage waste liquid is a high-concentration high-COD waste liquid. The existing treatment methods do not have a high COD removal capacity.

Method used

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  • Grinding machine pollution discharge waste liquid separation treatment method

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specific Embodiment 1

[0026] SeeFigure 1 , specific embodiment 1, a method for separating and treating the sewage waste liquid of the grinder, comprising the following steps:

[0027] Step 1: The wastewater solution in the wastewater tank is sent to the first reaction tank to add calcium chloride to adjust the PH to partial alkali;

[0028] Step 2, after entering the second reaction cell to add polyaluminum chloride;

[0029] Step 3, after entering the third reaction cell to add polyacrylamide;

[0030] Step 4, after entering the sedimentation tank, the sedimentation tank overflow into the low-temperature distillation equipment for distillation;

[0031] Step 5, distill the supernatant in the low-temperature distillation equipment, the clear liquid COD <1000, discharged into the wastewater system;

[0032] Step 6, the concentrate produced by distillation is discharged into the wastewater tank to re-enter the cycle.

[0033] This method avoids the generation of high concentration concentrate in the trad...

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Abstract

The invention relates to the technical field of semiconductor wastewater treatment. The method comprises the following steps: step 1, feeding a wastewater stock solution in a wastewater stock solution pool to a first reaction pool, and adding calcium chloride to adjust the pH value to be slightly alkaline; step 2, feeding into a second reaction tank, and adding polyaluminum chloride; step 3, feeding into a third reaction tank, and adding polyacrylamide; step 4, then entering a sedimentation tank, and enabling overflow of the sedimentation tank to enter low-temperature distillation equipment for distillation; step 5, distilling the supernatant with low-temperature distillation equipment, and discharging the supernatant into a wastewater system when the COD of the supernatant is less than 1000; and step 6, discharging a concentrated solution generated by distillation into a wastewater stock solution pool for re-circulation. According to the method, generation of a high-concentration concentrated solution in a traditional distillation process is avoided through circulating precipitation distillation, and high-concentration substances are separated into solid sludge. Adjusting, reacting (polyaluminum chloride (PAC) and polyacrylamide (PAM)), precipitating, distilling at low temperature, and treating low-COD supernate (less than 1000) in a grinding system of a wastewater station of a company.

Description

Technical field [0001] The present invention relates to the field of semiconductor wastewater treatment technology, specifically to a method for separating and treating the sewage waste liquid of a grinder. Background [0002] Grinder sewage waste liquid is a high concentration of high COD waste liquid, the existing treatment method, COD removal amount is not high. The COD value in the grinding waste liquid is about 70,000-230,000 on average, the allowable discharge of the two countries is <500, and the ability of the existing grinding system to dispose of COD is within 1000, so it is necessary to reduce the COD in the collected cleaning waste liquid and the grinding waste liquid to less than 1000 can enter the grinding system of the wastewater station to meet the discharge standards. Contents of the Invention [0003] In view of the problems existing in the prior art, the present invention provides a method for separating and treating the sewage waste liquid of the grinder, ...

Claims

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Application Information

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IPC IPC(8): C02F9/10C02F1/66C02F1/56C02F1/52C02F1/04C02F11/122B01D36/04C02F103/34
CPCC02F1/66C02F1/56C02F1/5236C02F1/04C02F11/122B01D36/04C02F2001/007C02F2103/346C02F2209/08C02F2301/046C02F2201/005
Inventor 吴飞祥吴永川施凯华
Owner 上海中欣晶圆半导体科技有限公司
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