Processing and manufacturing method of PCB (Printed Circuit Board) and PCB

Abstract

The invention provides a PCB processing and manufacturing method comprising the following steps that a PCB is provided, the PCB comprises a first circuit layer, a connection layer, a separation layer and a second circuit layer which are stacked in sequence, and the separation layer corresponds to a boss sinking area of the PCB; removing a boss sinking area part of the first circuit layer, and exposing a part of the connecting layer; cutting the exposed part of the connecting layer close to the non-exposed part; removing the separating layer to remove part of the connecting layer on the separating layer at the same time; and removing the boss sinking area part of the second circuit layer. Compared with the prior art, point-to-point elimination does not need to be carried out on part of the connecting layer needing to be removed, part of the connecting layer can be taken away at the same time only by lifting the separating layer, the manufacturing and processing time of the PCB is effectively saved, manufacturing and processing of the PCB become rapid and convenient, and meanwhile the characteristics that the precision is high, and the limitation of the laser technology is broken through are achieved.

Description

technical field [0001] The present application relates to a PCB production process, in particular to a processing and manufacturing method of a PCB board and a PCB board. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support body for electronic components, and a carrier for electrical interconnection of electronic components. It can replace complex wiring and realize the electrical connection between components in the circuit, which not only simplifies the assembly and welding of electronic products, reduces the workload of wiring in the traditional way, and greatly reduces the labor intensity of workers; it also reduces the size of the whole machine. volume, reduce product cost, and improve the quality and reliability of electronic equipment. At this stage, the processing of PCB boards in the industry is made by blind cutting machine to contr...

AI Technical Summary

Problems solved by technology

At present, the processing of PCB boards in the industry is made by blind cutting machine to control the depth of blind fishing, or laser machine burning skiving, but the above two methods have certain limitations: 1. The depth tolerance of blind cutting machine is the smallest ±100um, if the height of the boss is required to be less than 100um, or the tolerance is less than 100um, blind cutting cannot be made; 2. The laser aperture of the laser machine burning is limited, generally the maximum diameter is 180um, and there is an aspect ratio limit. When the subsidence area of ​​the platform is large, the number of holes increases accordingly

While the number of holes is increasing, the manufacturing time is also lengthened, but when the number of holes reaches a certain level, the machine cannot transfer the program.

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