Substrate baking device

A technology for baking devices and substrates, applied in printing devices, semiconductor devices, printing and other directions, can solve the problems of high expansion speed of the lower surface, affecting the baking effect of the substrate, and poor heating, so as to avoid warping and improve the baking effect. Effect

Pending Publication Date: 2022-05-27
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will lead to a higher expansion rate of the lower surface, which will cause the substrate to bend upwards, showing the shape of the corners on the four sides, and the corners will not be heated well, which will affect the baking effect of the substrate.

Method used

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Examples

Experimental program
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Embodiment 1

[0036] The main body of this embodiment is a substrate baking device, which is applied to the baking process of the substrate 30 after the substrate 30 is deposited by solution deposition. It should be noted here that the apparatus for baking the substrate 30 provided in this embodiment can be used for the baking process of the substrate 30 after the solution deposition method, and can also be used for other baking processes.

[0037] See figure 1 , image 3 and Figure 4 , in this embodiment, the substrate 30 baking device includes:

[0038] the heating table 10, the heating table 10 is formed with a heating surface 11 for carrying the heating surface 32 of the substrate 30;

[0039]The fixing mechanism is used to limit the relative displacement of at least one corner 31 of the substrate 30 and the heating table 10 in a direction perpendicular to the heating surface 11 when the heating surface 11 supports the substrate 30 .

[0040] Among them, the heating stage 10 mainly...

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PUM

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Abstract

The invention discloses a substrate baking device, and relates to the technical field of display surface processing technology, the substrate baking device is mainly characterized in that a fixing mechanism is arranged on the basis of a heating table, and the fixing mechanism is used for fixing a substrate when a heating surface bears the substrate. And the relative displacement of at least one corner part of the substrate and the heating table on the heating surface perpendicular to the heating surface is limited. In the heating process, even if the corners of the base plate are tilted due to the fact that the surfaces of the two sides of the base plate are not uniformly heated, the corners can be fixed relative to the heating table in the direction perpendicular to the heating surface under the action of the fixing mechanism, so that the problems of tilting and poor heating of the corners are avoided, and the heating quality of the base plate is improved. And the baking effect of the substrate is improved.

Description

technical field [0001] The present invention relates to the technical field of display surface manufacturing process, in particular, to a substrate baking device. Background technique [0002] Organic light-emitting diodes (Organic Light Emitting Diodes, OLEDs) have attracted attention in the display field due to their advantages of self-luminescence, no need for a backlight, high contrast ratio, fast response speed, good flexibility, and simple manufacturing process. Meanwhile, the existing organic light emitting diode display panel generally adopts an inkjet printing process. Because inkjet printing can precisely control droplets and has the advantages of low material cost and low equipment cost, inkjet printing is considered to be a technology with large development space in the preparation technology of large-size OLED panels. [0003] In detail, inkjet printing is a solution method for preparing thin films. The ink material required for the preparation of OLED is load...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J11/00H01L51/56
CPCB41J11/0024H10K71/00
Inventor 袁熙王世洪
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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