Semiconductor element assembling method

Abstract

The invention discloses an electronic component assembling method. The method comprises the following steps that 1, granular or small and broken non-standardized semiconductor components are fed through a vibration feeding device; step 2, feeding the module-standardized semiconductor element through an automatic tray conveying device; 3, taking and transferring the semiconductor elements fed by the vibration feeding device and the automatic tray conveying device in sequence through a taking manipulator; 4, the material taking manipulator sequentially releases the picked semiconductor elements on a loading station on an assembling device for assembling; a no-load assembly tray is arranged on the loading station, and a plurality of assembly notches are uniformly distributed in the assembly tray; the material taking manipulator is used for sequentially stacking and placing the picked semiconductor elements in the single assembly notches; fifthly, when the notches in the assembly trays at the loading station are fully loaded, the assembly trays are taken away and fed into the no-load assembly trays; according to the invention, intelligent production is realized, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of electronic assembly automation, in particular to a semiconductor element assembly method. Background technique [0002] The development of modern technology has promoted the rapid progress of electronic technology, especially the progress of electronic semiconductor and SMT technology has promoted integrated circuits, chips, on-chip systems, system chips, packaged chips, application processors, artificial intelligence chips, display screens, graphics cards , memory, RF amplifiers, LEDs, power devices, servers, power amplifier modules, power management and other semiconductor component technologies continue to advance. The result of the advancement of electronic technology is the ultra-thin / miniaturization, light weight, high frequency, high power and high density of components and devices. [0003] In the current electronic assembly industry, usually the semiconductor components of a standardized chip of a molded ...

AI Technical Summary

Problems solved by technology

[0003] In the current electronic assembly industry, usually the semiconductor components of a standardized chip of a molded module need to be assembled and welded by a variety of semiconductor components of different specifications; Manually use tweezers or other tools to pick up multiple semiconductor components one by one and stack them in the assembly mold for assembly; however, with the current ultra-thin / miniaturized and lightweight semiconductor components, the manual assembly method undoubtedly exists Problems such as low efficiency and difficult operation

Under the demand for mass supply, the number of chips that need to be exported is very large. The use of manual assembly will undoubtedly greatly limit the demand for production and supply, and it is difficult to achieve a breakthrough in shipments; while mechanical automation is becoming more and more intelligent. Today, with automation and automation, the demand for automatic assembly equipment for semiconductor components that can realize intelligent production and mass shipment is becoming more and more urgent

[0004] However, the existing problem is that in the assembly process of semiconductor products, the shapes and specifications of the semiconductor components that need to be assembled are different. There are not only standardized semiconductor components in modules, but also granular or small non-standardized semiconductor components; different Semiconductor components cannot be loaded with the same loading equipment, and each component needs to be loaded separately

Furthermore, standardized semiconductor components of the module can be loaded through the tray device; however, granular or small non-standardized semiconductor components have a small shape and are not easy to load through the tray, which makes it impossible to use traditional tray loading Therefore, how to simultaneously load semiconductor components of different specifications and how to load granular or broken non-standardized semiconductor components is a difficult point that needs to be solved at present

Images