Manipulator and suction cup

Abstract

The manipulator comprises the suction cup, the suction cup is used for adsorbing a wafer based on the Bernoulli principle, the suction cup is provided with a first surface and a second surface which are opposite and comprises a metal suction cup body, and the first surface of the metal suction cup body is covered with an insulating layer and provided with a plurality of air holes. The suction cup further comprises a plurality of insulation check blocks distributed in the circumferential direction of the metal suction cup body, the insulation check blocks are used for limiting the periphery of the wafer, all the insulation check blocks are connected with the metal suction cup body through a conductive layer, and the conductive layer is used for making contact with the edge of the wafer. By means of the configuration, it can be ensured that the suction cup successfully releases the wafer after vacuum release, and the risk of wafer breakage is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a manipulator and a suction cup. Background technique [0002] In the wafer processing process, the Bernoulli manipulator (suction cup) is a manipulator that utilizes the Bernoulli principle. The gas (such as inert gas such as nitrogen) ejected from the gas injection port of the manipulator meets the surface of the disc (such as the upper surface, Of course, it can also be the lower surface, take the above surface as an example), after the gas diffuses rapidly from the upper surface of the disk, the air velocity on the upper surface of the disk is greater than the air velocity on the lower surface. According to Bernoulli’s principle, at this time, The air pressure on the surface is greater than the air pressure on the upper surface of the disk, so that the disk is attracted to the Bernoulli manipulator. [0003] The Bernoulli manipulator absorbs the wafer through...

AI Technical Summary

Problems solved by technology

At present, the front body of the Bernoulli arm is made of metal materials, and the back body and stoppers are made of insulating materials. However, the insulating materials (such as fluororesin) have weak antistatic ability and are prone to electrostatic tip accumulation effect. The wafer and glass are in the process of dissociation. A large amount of static electricity generated accumulates on the insulating stopper, causing the Bernoulli arm to fail to effectively release the thin wafer after the vacuum is released, resulting in wafer fragmentation

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