A solar array and its preparation method and application
A solar array and printed circuit technology, applied in the field of solar cells, can solve the problems of complex structure, large volume and weight of the solar array, and achieve the effects of reducing electrical connection procedures, multiple payloads, and saving satellite costs and launch costs
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0103] This embodiment is a solar array and a preparation method thereof.
[0104] The solar array of this embodiment includes FPC and flexible CIC cells arranged in sequence.
[0105] In this embodiment, some areas of the FPC are sequentially set as follows figure 2 The following structure is shown:
[0106] Bottom layer 104 , adhesive layer 105 , printed circuit 106 , adhesive layer 105 and top layer 107 .
[0107] Wherein, the material of the bottom layer 104 is polyimide, and the thickness is 25 μm;
[0108] The material of the adhesive layer 105 is silica gel, and the thickness is 10 μm;
[0109] The material of the printed circuit layer 106 is copper, and the thickness is 25 μm;
[0110] The material of the adhesive layer 105 is silica gel, and the thickness is 10 μm;
[0111] The material of the top layer 107 is polyimide, and the thickness is 25 μm;
[0112] The material of the adhesive layer 105 is silica gel, and the thickness is 10 μm.
[0113] The schematic...
Embodiment 2
[0135] This embodiment is a solar array and a preparation method thereof.
[0136] The solar array of this embodiment includes FPC and flexible CIC cells arranged in sequence.
[0137] In this embodiment, some areas of the FPC are sequentially set as follows figure 2 The following structure is shown:
[0138] Bottom layer 104 , adhesive layer 105 , printed circuit 106 , adhesive layer 105 and top layer 107 .
[0139] Wherein, the material of the bottom layer 104 is polyimide, and the thickness is 50 μm;
[0140] The material of the adhesive layer 105 is silica gel, and the thickness is 20 μm;
[0141] The material of the printed circuit layer 106 is copper, and the thickness is 50 μm;
[0142] The material of the adhesive layer 105 is silica gel, and the thickness is 20 μm;
[0143] The material of the top layer 107 is polyimide, and the thickness is 50 μm;
[0144] The material of the adhesive layer 105 is silica gel, and the thickness is 20 μm.
[0145] The schematic...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com