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Self-cleaning device of evaporation table for semiconductor processing

An evaporation table and self-cleaning technology, which is applied in the direction of vacuum evaporation plating, metal material coating process, coating, etc., can solve the problems of inconvenient cleaning and easy residual cleaning dead ends, so as to avoid abrasion, avoid residual cleaning dead ends, and good The effect of cooling effect

Active Publication Date: 2022-03-08
江苏威森美微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to make up for the deficiencies of the existing technology, solve the problem that during the coating process of the evaporation table, the waste generated by the coating will accumulate on the surface of the evaporation table, and it is inconvenient to clean up after the waste solidifies; , a self-cleaning device for an evaporation table for semiconductor processing proposed by the present invention

Method used

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  • Self-cleaning device of evaporation table for semiconductor processing
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  • Self-cleaning device of evaporation table for semiconductor processing

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Embodiment

[0029] like Figure 1 to Figure 6 As shown in the figure, a self-cleaning device for an evaporation table for semiconductor processing according to the present invention includes an evaporation table body 1, a moving structure 2, an installation chassis 3, a lifting cylinder 4, an electric base 5, a vertical beam frame 6, a cleaning Structure 7 and dust removal structure 8, a moving structure 2 is arranged on the outside of the evaporation table body 1, one end of the moving structure 2 is installed with a mounting chassis 3, and a lifting cylinder 4 is installed in the center of the end face of the mounting bottom bracket 3, and the top of the lifting cylinder 4 is above the top An electric base 5 is provided, a vertical beam frame 6 is fixedly installed in the center of the top end face of the electric base frame 5, a cleaning structure 7 is arranged on one side of the end face of the vertical beam frame 6, and a dust removal structure 8 is arranged above the end face of the ...

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Abstract

The invention belongs to the technical field of semiconductor processing, and particularly relates to a self-cleaning device of an evaporation table for semiconductor processing, which comprises an evaporation table body, a moving structure, a mounting underframe, a lifting cylinder, an electric base, a vertical beam frame, a sweeping structure and a dust removal structure, a mounting bottom frame is mounted at one end of the moving structure, a lifting air cylinder is mounted in the center of the end face of the mounting bottom frame, an electric base is arranged above the top of the lifting air cylinder, and a vertical beam frame is fixedly mounted in the center of the end face of the top of the electric base; in the moving process of the moving structure, a lifting air cylinder and an electric base can adjust the height and the rotating angle of a vertical beam frame, so that the positions of a sweeping structure and a dust removal structure are adjusted, and the sweeping structure and the dust removal structure can conduct cleaning and dust removal on different positions of the top of the evaporation table body; the problem that cleaning dead corners are left is effectively solved, and a good self-cleaning effect is achieved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor processing, in particular to a self-cleaning device of an evaporation table for semiconductor processing. Background technique [0002] A semiconductor refers to a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. In the process of semiconductor processing, the original wafer needs to be processed by evaporation coating. [0003] Evaporation coating is a process of heating a metal with a lower melting point, so that the metal on the evaporation table is evaporated and attached to the wafer to be processed to form a coating. [0004] There are also some technical solutions about power generation in the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24
CPCC23C14/24
Inventor 胡长文陈金凌王锡胜李敏
Owner 江苏威森美微电子有限公司
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