Camera over-temperature protection method and device, storage medium and electronic equipment
A technology for over-temperature protection and cameras, applied in the fields of camera over-temperature protection methods, storage media, electronic equipment, and devices, capable of solving problems such as interrupted monitoring, reduced camera reliability, and lack of versatility
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Embodiment 1
[0029] figure 1 It is a flow chart of the camera over-temperature protection method provided in Embodiment 1 of the present application. This embodiment is applicable to the situation of over-temperature protection of the camera. This method can be executed by the camera over-temperature protection device provided in the embodiment of the present application. The device can be implemented by software and / or hardware, and can be integrated into devices such as smart terminals for camera processing.
[0030] Such as figure 1 As shown, the camera over-temperature protection method includes:
[0031] S110. Determine the current junction temperature of the camera SoC and the currently executed initial service;
[0032] In this embodiment, a System on Chip (Soc) is an integrated circuit with a dedicated target, which includes a complete system and all embedded software. The high temperature that a product can withstand goes online often depends on the chip specification temperatu...
Embodiment 2
[0079] Figure 4 It is a schematic diagram of the camera over-temperature protection process provided in the second embodiment of the present application, and the second embodiment is further optimized on the basis of the first embodiment. The specific optimization is: determining the current junction temperature of the camera SoC, including: if the camera has a junction temperature module, then based on the junction temperature module, reading the junction temperature of the camera SoC, and using the junction temperature as Current junction temperature; if the camera does not have a junction temperature temperature module, the current case temperature of the camera SoC is obtained based on the pre-installed analog-to-digital conversion sensor, and is calculated according to the current case temperature according to the preset junction temperature calculation formula The current junction temperature of the camera SoC. Wherein, details that are not described in detail in this ...
Embodiment 3
[0107] Figure 6 It is a schematic structural diagram of the camera over-temperature protection device provided in Embodiment 3 of the present application, as shown in Figure 6 As shown, the camera over-temperature protection device includes:
[0108] The current junction temperature determining module 610 is configured to determine the current junction temperature of the camera SoC and the initial service currently executed;
[0109] The first ambient temperature interval determining module 620 is used to determine the corresponding ambient temperature interval when the camera system-on-a-chip at the current junction temperature performs initial business in an abnormal working state, and use it as the first ambient temperature interval;
[0110] The target business determination module 630 is configured to determine the second ambient temperature range to which the first ambient temperature range belongs and the corresponding target business from the preset ambient temperat...
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