In-situ measurement system and method for low-temperature molded surface of key component of low-temperature equipment

Abstract

The invention relates to an in-situ measurement system and method for a low-temperature molded surface of a key component of low-temperature equipment, which aims to solve the technical problems that the low-temperature equipment goes wrong during a cold-state test, measurement cannot be carried out due to condensation or frosting on the surface of the equipment at a low temperature, a fault disappears after the temperature returns, and a fault reason cannot be found. A test unit in the system comprises a robot measuring unit, a liquid nitrogen low-temperature cooling unit and a transparent heat shield covering the two units. The robot measuring unit comprises a mechanical arm and a measuring instrument arranged at the front end of the mechanical arm; the liquid nitrogen low-temperature cooling unit comprises a liquid nitrogen storage tank; a low-temperature liquid nitrogen supply system in the system is used for providing low-temperature liquid nitrogen for a liquid nitrogen low-temperature cooling unit. The method comprises the following steps of 1, measuring at normal temperature, 2, immersing the to-be-tested piece in a liquid nitrogen storage tank filled with liquid nitrogen until the to-be-tested piece is cooled thoroughly, 3, blowing off air in the transparent heat insulation cover by using nitrogen, 4, discharging low-temperature liquid nitrogen, 5, testing without water, and 6, processing after testing.

Description

Technical field [0001] The present invention relates to a low temperature type surface in situ measurement, and a method of low temperature surface in situ measuring system and method is related to a low temperature device key component. Background technique [0002] The test method used by low temperature equipment such as low temperature valve is: first test at normal temperature, then cooling under low temperature medium such as liquid nitrogen, reflecting the equipment for cooling after cooling. [0003] During the cold test process, the device is in a low temperature. Requirements for reasons for the valves are required. However, as the temperature returns to a normal temperature state, some of the stagnation may occur due to low temperature change, and there is no failure, and therefore, the device often has failed at low temperatures. The temperature returns fault disappears, can't find the cause of the fault Case. Inventive content [0004] It is an object of the present...

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that low temperature equipment is stuck during cold state testing, poor coordination, etc., and in the low temperature state, due to contact with air, condensation or frost occurs on the surface of the low temperature equipment, making it impossible to perform measurement and state observation. After the fault disappears and the cause of the fault cannot be found, a system and method for in-situ measurement of low temperature profiles of key components of low temperature equipment are proposed

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