One-way heat conduction device

Abstract

The invention discloses a one-way heat conduction device which comprises the components of a main body which is provided with a closed vacuum cavity which is provided with a first surface and a second surface which are oppositely arranged; a capillary structure is arranged on the first surface, and the capillary structure is filled with a phase change working medium; an organic vesicle layer is arranged on the second surface and can expand with heat and contract with cold along with the change of temperature, and the organic vesicle layer is provided with a plurality of organic vesicles. the one-way heat conduction can be realized; the heating element can be prevented from being damaged due to overheating caused by reverse heat conduction in the heat dissipation process, and excessive heat dissipation of the heating element in the heat dissipation process can be avoided; by reasonably selecting the phase change working medium filled in the capillary structure, the vaporization temperature of the phase change working medium can be controlled, so that the heat conduction device can be suitable for working scenes with various heat conduction requirements, and the heat conduction process can be accurately controlled.

Description

technical field [0001] The invention belongs to the technical field of heat conduction devices, and in particular relates to a one-way heat conduction device. Background technique [0002] With the rapid progress of electronic technology, electronic components are becoming more and more miniaturized, but their power consumption is increasing, so that heat dissipation technology seriously restricts the development of electronic technology. Therefore, it is particularly important to solve the heat dissipation problem of electronic components. [0003] The current heat conduction device is generally only suitable for the environment where the temperature of the electronic components is higher than the external temperature. If the external environment temperature of the equipment is too high and the electronic components are too high, the heat conduction device will not be able to achieve a good heat dissipation effect, and even the electronic components will appear. Already in...

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Problems solved by technology

[0003] The current heat conduction device is generally only suitable for the environment where the temperature of the electronic components is higher than the external temperature. If the external environment temperature of the equipment is too high and the electronic components are too high, the heat conduction device will not be able to achieve a good heat dissipation effect, and even the electronic components will appear. Already in a heating state, the heat conduction device still conducts the heat of the external environment to the electronic components, which leads to overheating of the electronic components, resulting in potential safety hazards

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