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Integrated liquid circulation low-temperature radiator

A liquid circulation and radiator technology, applied in indirect heat exchangers, refrigeration and liquefaction, lighting and heating equipment, etc., can solve the problems of poor heat dissipation effect, inconvenient maintenance process, loose structure, etc., and achieve the overall compact structure of the device. Precise, well organized and placed effects

Active Publication Date: 2021-11-30
晋江爱家制冷设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing radiators have some deficiencies during use. First, the structure is relatively loose. Due to the variety and complexity of the connecting pipelines, it affects the overall appearance and is extremely inconvenient in the subsequent maintenance process. There is a lack of auxiliary cooling devices between the connecting parts, resulting in poor heat dissipation and affecting the use experience of the radiator

Method used

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Embodiment Construction

[0018] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0019] Such as figure 1 , figure 2 As shown, an integrated liquid circulation low-temperature radiator includes a heat dissipation housing 15, a heat dissipation pipe 16, and a heat dissipation assembly 17. One side of the heat dissipation housing 15 is fitted with a sealing plate 13, and the sealing plate 13 is integrally It is in a square shape, and a plurality of heat dissipation pipe hole seals 14 are evenly arranged on the sealing plate 13, and the plurality of heat dissipation pipe hole seals 14 are respectively arranged opposite to the axes of the corresponding heat dissipation pipes 16, and one side of the sealing plate 13 is attached to A radiator deflector 11 is provided, and one side of the radiator deflector 11 is fitted with a deflector assembly 5, and the deflector assembly 5 is square in shape as a whole. A water pump volute ca...

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Abstract

The invention discloses an integrated liquid circulation low-temperature radiator. The integrated liquid circulation low-temperature radiator comprises a heat dissipation shell, heat dissipation pipes and a heat dissipation assembly, wherein a sealing plate is arranged at one side of the heat dissipation shell in an attached manner, the whole sealing plate is in a square shape, a plurality of heat dissipation pipe hole seals are evenly arranged on the sealing plate, and the multiple heat dissipation pipe hole seals are arranged opposite to the axes of the corresponding heat dissipation pipes correspondingly; and a radiator guide plate is attached to one side of the sealing plate, and a water tank is provided with a plurality of groups of high-temperature liquid inlets and low-temperature liquid outlets, so that pipelines in multiple directions are convenient to install, and power loss in the pipelines caused by unnecessary bending is avoided; meanwhile, a semiconductor hot-end heat-conducting plate, a semiconductor chilling plate, a semiconductor cold-end heat-conducting plate and a flow guide assembly are arranged, so that water flow can be further cooled, internal heat flow is rapidly cooled, and the use requirement is met; and a mounting cavity is arranged, so that the pipelines can be well arranged and placed, and the whole structure of the device is more compact and precise.

Description

technical field [0001] The invention relates to the field of radiators, in particular to an integrated liquid circulation low-temperature radiator. Background technique [0002] Common radiators can be divided into air cooling, heat pipe radiators, liquid cooling, semiconductor refrigeration, compressor refrigeration and other types according to the heat dissipation method. [0003] However, the existing radiators have some deficiencies in the use process. First, the structure is relatively loose. Due to the variety and complexity of the connecting pipelines, it affects the overall appearance and is extremely inconvenient in the subsequent maintenance process. There is a lack of auxiliary cooling devices between the connecting parts, resulting in poor heat dissipation and affecting the use experience of the radiator. Contents of the invention [0004] In order to solve the above existing problems, the present invention provides an integrated liquid circulation low tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F25B39/00F25B21/02F28D21/00
CPCF25B39/00F25B21/02F28D21/00
Inventor 黄春宋
Owner 晋江爱家制冷设备有限公司
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