Circuit board film pasting device and method and intelligent industrial control equipment

Abstract

The invention relates to the field of circuit board protection film pasting, in particular to a circuit board film pasting device and method. The device comprises a film supply mechanism and a film cutting mechanism; the film supply mechanism comprises a material supply disc, a fixed clamping head, a movable clamping head and a material receiving disc; the fixed clamping head comprises a fixed cylinder and fixed heads, the fixed cylinder is fixed on a workbench, the output end of the fixed cylinder is connected with the upper and lower fixed heads, and the inner side surfaces of the upper and lower fixed heads are contacted with the upper and lower surfaces of a protective film; the movable clamping head comprises a clamping head driving element, a movable air cylinder and a movable head; the driving end of the clamping head driving element is connected with a movable cylinder, the output end of the movable cylinder is respectively connected with upper and lower movable heads, and the inner side surfaces of the upper and lower movable heads are respectively contacted with the upper and lower surfaces of the protective film; and the cut-off end of the film cutting mechanism is in contact with the protective film between the fixed clamping head and the movable clamping head. According to the circuit board film pasting device, the pulling-out process and the fixing process of the protective film are automatically completed through equipment, the labor intensity of workers is reduced, and the film supply efficiency is improved.

Description

technical field [0001] The invention relates to the field of protective film sticking to circuit boards, in particular to a film sticking device and method for circuit boards. Background technique [0002] The circuit board, also known as the circuit board, is provided with conductive patterns and holes on the substrate to replace the chassis of the previous electronic components and realize the interconnection between electronic components, which can greatly reduce wiring and assembly errors and improve the automation level. and production efficiency. In the production process of printed circuit boards, the circuit boards need to be protected. The commonly used method is to mount protective films on the top and bottom of the circuit boards. [0003] Chinese invention patent application (publication number CN112601378A, publication date: 20210402) discloses an automatic film laminating machine based on PCB soft board, including a body. A feeding chamber is communicated bet...

AI Technical Summary

Problems solved by technology

[0004] The prior art has the following deficiencies: manually pull out the protective film of the feeding tray to the set position, and then manually operate the clamp to fix the pulled out protective film for the film cutting mechanism to cut the film, which increases the labor intensity of workers and reduces the Film supply efficiency

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