A Method for Determining Baking Parameters of Thick Film Hybrid Integrated Circuit Products

A mixed technology of integrated circuits and thick films, applied in the direction of removing certain component weighing, material weighing, instruments, etc., can solve the problems of no basis for the accuracy of process parameters, and the inability to carry out process and optimization in a targeted manner , to achieve the effect of shortening the verification cycle

Active Publication Date: 2022-04-05
SHENZHEN ZHENHUA MICROELECTRONICS
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for determining the baking parameters of thick-film hybrid integrated circuit products, so as to solve the problem that the accuracy of the process parameters of the adhesive glue used in the existing thick-film hybrid integrated circuit products has no basis and cannot be targeted. Technical Issues in Carrying out Process Optimization

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  • A Method for Determining Baking Parameters of Thick Film Hybrid Integrated Circuit Products
  • A Method for Determining Baking Parameters of Thick Film Hybrid Integrated Circuit Products

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[0030] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .

[0031] see Figure 1 to Figure 3 , the invention discloses a method for determining the baking parameters of thick-film hybrid integrated circuit products. The baking process of thick-film hybrid integrated circuit products is carried out in thermogravimetric-infrared-gas chromatography equipment, and thermogravimetric-infrared-gas mass spectrometry The combined equipment includes a thermogravimetric analyzer, an infrared spectrometer, and a gas spectrometer, which integrates the three instruments. The method for determining the baking parameters of the thick-film hybrid integrated circuit product includes the following steps:

[0032] S101. Sampling ...

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Abstract

The invention discloses a method for determining the baking parameters of a thick-film hybrid integrated circuit product, which includes a sampling step, a sample weighing step, a water vapor quantitative measurement step and a water vapor qualitative measurement step, and an adhesive glue sample is taken on the thick-film hybrid integrated circuit product Place the sample in the thermogravimetric analyzer to weigh the weight of the initial sample, heat the sample with the thermogravimetric analyzer, so that the sample evaporates water vapor, and when the weight of the sample no longer changes, weigh the weight of the final sample, And import the weight and heating temperature data of the sample at each time period to the display screen; use an infrared spectrometer to detect the water vapor volatilized by the sample by infrared spectroscopy, perform quantitative analysis on the water vapor, and import the concentration data of each component of the water vapor to the display screen Carry out qualitative detection of water vapor with GC-MS, and use the curve equation to obtain each component in the water vapor and the relative concentration value corresponding to each component, and import the data of each component and its relative concentration to the display screen.

Description

technical field [0001] The invention relates to the technical field of gas detection, in particular to a method for determining baking parameters of thick-film hybrid integrated circuit products. Background technique [0002] The manufacturing process steps of thick film hybrid integrated circuit products include gluing steps, mounting steps and curing steps. The gluing steps and mounting steps are all carried out in the placement machine, that is, the adhesive glue is first applied on the ceramic substrate. , several devices are bonded on the ceramic substrate that has been glued, and the curing step is carried out in a curing furnace. . [0003] However, in the existing production of thick film hybrid integrated circuit products, the state of the adhesive is judged by the naked eye, and then the performance test of the entire product is carried out, and the baking temperature and time are adjusted at any time according to the needs, resulting in the use of There is no ba...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N5/04G01N21/3554G01N30/02
CPCG01N5/045G01N21/3554G01N30/02
Inventor 王晓卫祝涵陈如平
Owner SHENZHEN ZHENHUA MICROELECTRONICS
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