Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multilayer printed circuit board and manufacturing method thereof

A technology of multi-layer printing and manufacturing method, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc. Difference in copper ratio, effect of reducing internal stress on board

Active Publication Date: 2021-10-19
SHENZHEN KINWONG ELECTRONICS
View PDF13 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The application provides a multi-layer printed circuit board and its manufacturing method to solve the problem that the multi-layer printed circuit board is easy to warp

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer printed circuit board and manufacturing method thereof
  • Multilayer printed circuit board and manufacturing method thereof
  • Multilayer printed circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings, that is, embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] It should be noted that when a component is referred to as being “fixed on” or “disposed on” another component, it may be directly or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of technical features. "Plurality" means two or more, unless otherwise clearly and specifically defined. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Radiusaaaaaaaaaa
Login to View More

Abstract

The invention is applicable to the technical field of printed circuit boards, and provides a multilayer printed circuit board, which comprises at least two circuit layers. The at least two circuit layers comprise copper foil areas, the copper foil area of at least one circuit layer is provided with a plurality of copper digging parts arranged in an array, and the copper digging parts are formed in a manner of removing part of copper foil. The invention also provides a manufacturing method of the multilayer printed circuit board. According to the multilayer printed circuit board and the manufacturing method thereof, the residual copper rate of the circuit layer can be adjusted, local stress in the board is eliminated, and the problem of board warping is solved.

Description

technical field [0001] The invention relates to the technical field of multilayer printed circuit boards, in particular to a multilayer printed circuit board and a manufacturing method thereof. Background technique [0002] At present, electronic products such as mobile phones have more and more functions, and the volume is becoming thinner and smaller. Under this development trend, the printed circuit boards assembled in electronic products are also required to be thinner and thinner. At present, the thickness of the 10-layer High Density Interconnector (HDI) board is less than 0.6mm. This kind of HDI board is prone to warpage during production. If the warpage is too large, it will affect the placement and packaging . Among them, the copper area distribution of each layer in the printed circuit board is not uniform, and the internal stress of the printed circuit board is the main cause of warping. At present, the problem of board warpage is usually improved by pressing an...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/14H05K3/46
CPCH05K3/4611H05K1/14
Inventor 肖安云陈前王俊
Owner SHENZHEN KINWONG ELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com