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Ball mounting tool for maintaining set top box chip

A technology for repairing machines and chips, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inconvenient use, low efficiency, and messy pins

Pending Publication Date: 2021-10-15
泉州盈创电子股份公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, if the BGA device needs to be repaired, when it is disassembled from the circuit board, due to the melting and deformation of the pin material at high temperature, after the device is disassembled, the BGA pins will become a messy shape, so new ones need to be implanted. Solder balls, at present, in production, usually manually plant the balls on the surface of the chip, which is inefficient and inconvenient to use, so a ball planting device is needed to improve the ball planting efficiency

Method used

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  • Ball mounting tool for maintaining set top box chip
  • Ball mounting tool for maintaining set top box chip
  • Ball mounting tool for maintaining set top box chip

Examples

Experimental program
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Embodiment Construction

[0038] The present invention will be further described below in conjunction with accompanying drawing:

[0039] Such as Figure 1-8As shown, this embodiment provides a ball planting tool for repairing set-top box chips, including a base assembly 1 , a stencil installation device 2 , a synchronous clamping device 3 , a chip installation device 4 and a stencil synchronous lifting device 5 .

[0040] The stencil installation device 2 includes a mold fixing middle frame 22, an eccentric quick release device 23 and a ball planting steel mesh 21. The mold fixing middle frame 22 is inlaid with a plurality of first permanent magnets 221, and the lower side of the mold fixing middle frame 22 is provided with a middle The frame lower wall baffle 222, the middle frame lower wall baffle 222 blocks the base assembly 1, the eccentric quick release device 23 is rotatably installed on the middle frame lower wall baffle 222 and the eccentric quick release device 23 squeezes the base assembly 1...

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PUM

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Abstract

The invention relates to a ball mounting tool for maintaining a set top box chip. The ball mounting tool comprises a base assembly, a steel mesh mounting device which is used for fixedly mounting the ball mounting steel mesh; a synchronous clamping device which is used for synchronously clamping the chip; a chip mounting device which is used for quickly clamping and positioning the chip; a steel mesh synchronous lifting device which is used for synchronously jacking the ball mounting steel mesh, so ball mounting of the to-be-maintained set top box chip is facilitated, and the ball mounting efficiency is high.

Description

technical field [0001] The invention relates to the technical field of chip ball planting, in particular to a ball planting tool for repairing chips in a set-top box. Background technique [0002] Most of the chip pins are made of tin-containing material. On the one hand, during the assembly process of the circuit board, the solder on the device will melt due to the high temperature welding of the device, and will be fused with the circuit terminal on the circuit board. In addition, if the BGA device needs to be repaired, when it is disassembled from the circuit board, due to the melting and deformation of the pin material at high temperature, after the device is disassembled, the BGA pins will become a messy shape, so new ones need to be implanted. Solder balls, currently in production, usually manually plant balls on the surface of the chip, which is inefficient and inconvenient to use. Therefore, a ball planting device is needed to improve the ball planting efficiency. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/68721H01L21/68785H01L21/68792H01L21/67144
Inventor 陈华煜曾春华
Owner 泉州盈创电子股份公司
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