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High-precision chip assembly structure with isolator

An assembly structure and isolator technology, which is applied in the field of optical communication, can solve the problems of high cost of isolators, low assembly accuracy, and inconvenient assembly, and achieve the effects of improving assembly accuracy, reducing material costs, and simple structure

Pending Publication Date: 2021-09-28
江西师范高等专科学校
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  • Abstract
  • Description
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Problems solved by technology

However, the current isolator has high cost, inconvenient assembly, and low assembly accuracy. Therefore, a high-precision chip assembly structure with isolator is needed

Method used

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  • High-precision chip assembly structure with isolator
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  • High-precision chip assembly structure with isolator

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] see Figure 1~3 , the present invention provides a technical solution: a high-precision chip assembly structure with an isolator, including a metal front cover 6, the lower end of the metal front cover 6 is provided with an upper pressure plate 5, and the lower end of the upper pressure plate 5 is integrally connected with an upper Press block 4, a lower press block 2 is arranged below the upper press block 4, the lower end of the metal front cover 5 is...

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Abstract

The invention discloses a high-precision chip assembly structure with an isolator, which comprises a metal front cover, an upper pressing plate is arranged at the lower end of the metal front cover, an upper pressing block is integrally connected to the lower end of the upper pressing plate, a lower pressing block is arranged below the upper pressing block, and the lower end of the metal front cover is inserted into the upper pressing plate and the upper pressing block. A ceramic sleeve is installed in the metal front cover, the structure is simple, the construction is clear and easy to understand, the square hole is square, the isolator is accurately positioned when installed, it is guaranteed that the installation angle of the isolator is within a predicted range, and meanwhile installation errors caused by rotation deviation of the isolator during installation and after installation are prevented; high-precision installation of the isolator is realized; the magnetic isolator is adopted, so that the two-time assembly required by the installation of the isolator is changed into one-time assembly, the assembly precision of the isolator is improved, the chip area of the isolator can be reduced under the condition of ensuring the full coverage of an optical path, and the material cost is greatly reduced.

Description

technical field [0001] The invention relates to the field of optical communication, in particular to a high-precision chip assembly structure with an isolator. Background technique [0002] In recent years, with the increasing speed of data transmission, traditional electrical communication has been unable to meet the transmission needs of various fields, and optical communication technology has made up for the shortcomings of traditional electrical communication technology such as short transmission distance, high energy consumption, and slow transmission speed. It is widely used in various data transmission. In an optical communication module, when light enters (or exits from) various optical components or optical fibers from a light source such as a laser, some of the light will be on the end face or inside of various optical components or optical fibers, etc. The part is reflected or scattered, and when the reflected or refracted light returns through the original path,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B7/00G02B6/27
CPCG02B7/00G02B6/2746
Inventor 郭文杰倪鲁淇饶思维
Owner 江西师范高等专科学校
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