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Large-area thin film pressure sensor

A technology of pressure sensor and large-area thin film, which is applied in the measurement of fluid pressure using piezoelectric devices and the measurement of the property and force of piezoelectric resistance materials, etc. It can solve the problems of poor stability, self-collapse, and poor consistency of output performance of thin-film pressure sensors. and other issues to achieve the effect of improving consistency and quick response

Pending Publication Date: 2021-09-17
苏州慧闻纳米科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One purpose of the present invention is to solve the technical problem that the large-area thin-film pressure sensor in the prior art cannot return to its original state due to the problem of self-collapse after being subjected to external pressure, which makes the output performance of the thin-film pressure sensor poor in consistency and stability.

Method used

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Embodiment Construction

[0031] figure 2 A schematic structural diagram of a large-area thin-film pressure sensor according to an embodiment of the present invention is shown. Such as figure 2 As shown, the large-area thin-film pressure sensor includes an upper encapsulation layer 1 , a lower encapsulation layer 4 , an electrode layer 5 , a nano-sensitive layer 2 and a flexible support layer 3 . The electrode layer 5 is formed on the lower encapsulation layer 4, and the electrode layer 5 is connected to an external power source. The nano-sensitive layer 2 is formed on the upper encapsulation layer 1 in a film form. The flexible support layer 3 is arranged between the nano-sensitive layer 2 and the electrode layer 5, and is configured to allow the nano-sensitive layer 2 and the electrode layer 5 to When the external pressure is removed, the nano-sensitive layer 2 and the electrode layer 5 are completely separated.

[0032] According to the solution of the present invention, by adding a flexible s...

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Abstract

The invention provides a large-area thin film pressure sensor. The large-area thin film pressure sensor comprises an upper packaging layer, a lower packaging layer, an electrode layer which is arranged on the lower packaging layer, and is connected with an external power supply, a nano sensitive layer which is formed on the upper packaging layer in a film form; and a flexible supporting layer which is arranged between the nano sensitive layer and the electrode layer, and is configured to allow the nano sensitive layer to be in contact with the electrode layer when the large-area thin film pressure sensor is subjected to external pressure and enable the nano sensitive layer to be completely separated from the electrode layer when the external pressure is removed. According to the large-area thin film pressure sensor, the consistency and the stability of the output performance of the thin film pressure sensor are greatly improved.

Description

technical field [0001] The invention relates to the technical field of pressure detection, in particular to a large-area film pressure sensor. Background technique [0002] The film pressure sensor has good flexibility, ductility, and can even be bent or folded freely, and its structure is flexible and diverse. It can be arranged arbitrarily according to the requirements of the measurement conditions, and it is very convenient to detect complex measurands. Therefore, the new flexible sensor is widely used in the fields of electronic skin, medical care, electronics, electrical engineering, sports equipment, textiles, aerospace, environmental monitoring and so on. [0003] However, when the area of ​​the thin-film pressure sensor is large, it faces the problems of self-collapse and slow recovery from deformation. A traditional thin-film pressure sensor includes an electrode layer and a sensitive thin-film layer. When the thin-film pressure sensor is under pressure, the electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18G01L9/08
CPCG01L1/18G01L9/08
Inventor 雷浩冯长海张平平
Owner 苏州慧闻纳米科技有限公司
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