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Device for chip testing

A chip testing and chip technology, which is applied in the direction of measuring devices, electronic circuit testing, and parts of electrical measuring instruments, etc., can solve problems such as inaccurate chip test results, easily skewed probes, poor contact, etc.

Pending Publication Date: 2021-09-10
SUZHOU TF AMD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] During the above test process, the probes of the test base are easily skewed, resulting in poor contact and inaccurate chip test results

Method used

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  • Device for chip testing
  • Device for chip testing

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Embodiment Construction

[0024] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain related inventions, rather than to limit the invention. It should also be noted that, for ease of description, only parts related to the invention are shown in the drawings.

[0025] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and embodiments.

[0026] figure 1 and figure 2 A schematic structural diagram of a device for chip testing is shown.

[0027] A device for chip testing includes: a test bench 20 and a test base 10 . The test bench 20 is used to carry the chip to be tested, and the test bench 20 is provided with a through hole 2...

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Abstract

The invention relates to the technical field of chips, and discloses a device for chip testing. The device for chip testing comprises a test board which is used for bearing a to-be-tested chip and is provided with a through hole, and a test base which is provided with a probe which fixedly matches the through hole, the probe extends out of the through hole, so that the test base can be electrically connected with the chip to be tested, and the test base is in casting connection with the test board. According to the invention, the test base is in casting connection with the test board, thereby preventing the probe from inclining or bending because the probe frequently passes through or goes out of the through hole of the test board, and facilitating the stable electric connection between the to-be-tested chip and the test base; the probe matches the through hole, the through hole limits the degree of freedom of the probe in the horizontal direction, and the perpendicularity of the probe is protected.

Description

technical field [0001] The present invention generally relates to the technical field of chips, in particular to a device for chip testing. Background technique [0002] A chip generally refers to the carrier of an integrated circuit, and is also the result of the design, manufacture, packaging, and testing of an integrated circuit. It is usually an independent whole that can be used immediately. After the chip is manufactured, strict tests are required, such as aging test and optical power test. [0003] In the related art, the chip testing device includes a chip carrier and a test base. During the test, the chip to be tested is placed on the chip carrier, and the probes of the test base need to pass through the holes of the chip carrier and the chip to be tested. Electrically connected to achieve chip testing. [0004] During the above test process, the probes of the test base are easily skewed, resulting in poor contact and inaccurate chip test results. Contents of th...

Claims

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Application Information

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IPC IPC(8): G01R31/28G01R1/073
CPCG01R31/2886G01R1/07364
Inventor 刘在福曾昭孔郭瑞亮陈武伟
Owner SUZHOU TF AMD SEMICON CO LTD
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