Pressure-adjustable magnetic core bonding tool

Abstract

The invention relates to a pressure-adjustable magnetic core bonding tool, and belongs to the technical field of magnetic core bonding. The pressure-adjustable magnetic core bonding tool comprises a base, a lower magnetic core groove used for placing a lower magnetic core, a circuit board groove used for placing a circuit board and an upper magnetic core groove used for placing an upper magnetic core plate are sequentially formed in the base from bottom to top, and a positioning window facilitating the placing of the upper magnetic core is formed in the upper magnetic core plate. The upper magnetic core and the lower magnetic core are fixedly arranged on the upper surface and the lower surface of the circuit board in an aligned mode, and a pressing device used for pressing the upper magnetic core and the lower magnetic core is arranged vertically above the upper magnetic core plate. The tool has the beneficial effects that the tool has the functions of positioning upper magnetic core and the lower magnetic core, adjusting the pressure and maintaining the pressure; the positioning of the upper magnetic core and the lower magnetic core can realize that the magnetic cores are aligned and bonded without deviation, the pressure can be adjusted to determine proper pressure in a module test stage, the pressure maintaining function ensures that the pressure is consistent and unchanged in a magnetic core adhesive curing process, the consistency of output parameters of a power supply module can be ensured, and the production efficiency can be improved.

Description

technical field [0001] The invention belongs to the technical field of magnetic core bonding, and in particular relates to a pressure-adjustable magnetic core bonding tool. Background technique [0002] The DC / DC power module has the characteristics of small size and high integration density. As the core component of the module, the transformer is composed of a magnetic core and prefabricated printed lines in the printed board. The magnetic core is required to be as attached figure 1 As shown, the reserved position of the printed board is aligned and bonded tightly. During the bonding process, the position of the magnetic core cannot be shifted. The pressure requirement is moderate and kept until the adhesive is completely cured, otherwise the output parameters of the power module will be affected. [0003] The traditional magnetic core bonding method is to apply glue on the bonding surface of the magnetic core, align the two magnetic cores by visual inspection, then clamp t...

AI Technical Summary

Problems solved by technology

[0003] The traditional magnetic core bonding method is to apply glue on the bonding surface of the magnetic core, align the two magnetic cores by visual inspection, then clamp the magnetic core with ordinary clips, and finally put it into a curing oven for curing. The work efficiency is low and the output parameters are consistent. Poor performance, low product pass rate, unable to carry out mass production

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