Sensor assembling equipment

A technology for assembling equipment and sensors, which is applied in the direction of mechanical equipment, material gluing, connecting components, etc., can solve the problems of low production efficiency of sensors and achieve the effect of improving production efficiency

Active Publication Date: 2021-08-03
WUHAN FINEMEMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The main purpose of the present invention is to propose a sensor assembly equipment, aiming to solve the problem of low production efficiency of traditional sensors

Method used

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Embodiment Construction

[0057] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0058] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0059] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses sensor assembling equipment. The sensor assembling equipment comprises a conveying mechanism and a core packaging device, a first high-temperature curing device, an upper cover mounting device, a second high-temperature curing device and a conditioning testing device which are sequentially arranged in the machining direction. According to the technical scheme, the conveying mechanism is arranged, the core packaging device, the first high-temperature curing device, the upper cover mounting device, the second high-temperature curing device and the conditioning testing device are sequentially arranged in the machining direction, therefore, core mounting, upper cover mounting and conditioning testing procedures can be orderly and automatically carried out, automatic and continuous machining of sensor assembly is achieved, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of sensor processing, in particular to sensor assembly equipment. Background technique [0002] A sensor is a detection device that can sense the measured information and convert the sensed information into electrical signals or other required forms of information output according to certain rules to meet the requirements of information transmission, processing, storage, and display. , recording and control requirements. According to their basic sensing functions, sensors include temperature sensors, pressure sensors, photosensitive sensors, etc. [0003] The sensor is generally composed of four parts: sensitive element, conversion element, conversion circuit and auxiliary power supply. When processing the sensor, it needs to go through multiple assembly and testing processes. In the existing processing technology, it is usually completed step by step according to the process. The area is large and the pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 王小平曹万唐文齐擎
Owner WUHAN FINEMEMS
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