Eutectic welding equipment and its heating system

A eutectic welding and equipment technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as uneven heating of wafers, achieve uniform heating, and solve the effect of uneven heating

Active Publication Date: 2022-02-25
恩纳基智能科技无锡有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present disclosure provides a eutectic welding device to at least solve the technical problem in the prior art that the wafers are heated unevenly during the eutectic welding process, resulting in defects in the eutectic welding between wafers

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  • Eutectic welding equipment and its heating system
  • Eutectic welding equipment and its heating system
  • Eutectic welding equipment and its heating system

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Embodiment Construction

[0021] It should be noted that, in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings and embodiments.

[0022] In order to enable those skilled in the art to better understand the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only It is an embodiment of a part of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present disclosure.

[0023] It should be noted that the terms "first" a...

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Abstract

The present application discloses a eutectic welding device, which is used for performing eutectic bonding operations on an upper wafer and a lower wafer. The eutectic bonding equipment includes: a wafer stage, used to carry and heat an upper wafer and a lower wafer; and a pressure component, used to apply pressure to the upper wafer. Moreover, the eutectic welding equipment also includes: a temperature sensor array, including a plurality of temperature sensors arranged on the lower surface of the pressure component, and the plurality of temperature sensors correspond to multiple regions of the upper surface of the upper wafer; the heating component array, It includes a plurality of heating assemblies arranged in the wafer table, and the positions of the plurality of heating assemblies correspond to the positions of the plurality of temperature sensors; According to the measured temperature value of a temperature sensor, the heating temperature of multiple heating components is adjusted, so that the temperature distribution of the upper wafer and the lower wafer in the wafer plane is uniform.

Description

technical field [0001] The present application relates to the field of semiconductor manufacturing, in particular to a eutectic welding device. Background technique [0002] Wafer-level bonding using eutectic metals is a process used in semiconductor manufacturing today to provide an electrical connection between two wafers. In the eutectic bonding process, two aligned wafers are placed on a wafer stage. Wherein, germanium (Ge) material is deposited on the upper wafer, and aluminum (Al) material is deposited on corresponding positions of the lower wafer. In the process of eutectic bonding, the piston drives the pressure assembly to apply pressure to the upper wafer, and at the same time the wafer table is heated to slightly below the eutectic melting point, so that the germanium material of the upper wafer and the aluminum material of the lower wafer are bonded together. Together, an intermetallic compound is formed. In this way, the upper wafer and the lower wafer are co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/603H01L21/67
CPCH01L24/75H01L21/67248H01L21/67103H01L2224/753
Inventor 吴超曾义徐金万蒋星余再欢
Owner 恩纳基智能科技无锡有限公司
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