A low-temperature sintered shell-type tin-bismuth alloy powder and its preparation method and application

A tin-bismuth alloy, low-temperature sintering technology, applied in metal processing equipment, metal material coating process, liquid chemical plating, etc., can solve the problem of increased contact area between copper powder and air, unable to meet long-term use requirements, and poor circuit weather resistance and other problems, to achieve the effect of being beneficial to circuit leveling, improving electrical conductivity and weather resistance, and improving printing performance

Active Publication Date: 2022-04-01
EAST CHINA UNIV OF SCI & TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the coating layer is a metal-organic compound, it decomposes and releases gas during the sintering process, resulting in the formation of a porous structure on the surface of the conductive film, increasing the contact area between the copper powder and the air, which is easily oxidized, and the circuit has poor weather resistance, which cannot meet the long-term use requirements.

Method used

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  • A low-temperature sintered shell-type tin-bismuth alloy powder and its preparation method and application
  • A low-temperature sintered shell-type tin-bismuth alloy powder and its preparation method and application
  • A low-temperature sintered shell-type tin-bismuth alloy powder and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] The preparation of a low-temperature sintered shell-type tin-bismuth alloy powder Ag@Sn-58Bi includes the following steps:

[0057] The first step, co-reduction to prepare alloy precursors

[0058] The 3.4g SnCl that mass ratio is 1:1.97 2 , 6.7g Bi(NO 3 ) 3 ·5H 2 O was dissolved in 63mL of diethylene glycol, and 0.75g of polyvinylpyrrolidone was added. The amount of polyvinylpyrrolidone accounted for 7.43% of the total mass of the tin salt and bismuth salt, and stirred until the solution was clear and transparent, as the mother liquor.

[0059] Dissolve 3.24g of sodium hydroxide in 65mL of ethanol as lye for adjusting acidity and alkalinity.

[0060] Dissolve 3.27g of sodium borohydride in 30mL of diethylene glycol, add 0.36g of polyvinylpyrrolidone (dispersant), and 3 drops of the above-mentioned lye (to inhibit the decomposition of the reducing agent), and prepare a reducing solution. The dosage of the reducing agent sodium borohydride is 0.32 times of the total...

Embodiment 2

[0071] A low-temperature sintered shell-type tin-bismuth alloy powder SiO 2 The preparation of @Sn-52Bi includes the following steps:

[0072] The first step, co-reduction to prepare alloy precursors

[0073] The 3.8g SnCl that mass ratio is 1:1.53 2 , 5.82g Bi(NO 3 ) 3 ·5H 2 O was dissolved in 63mL of diethylene glycol, and 0.75g of polyvinylpyrrolidone was added. The amount of polyvinylpyrrolidone accounted for 7.8% of the total mass of the tin salt and bismuth salt, and stirred until the solution was clear and transparent, as the mother liquor.

[0074] Dissolve 3.24g of sodium hydroxide in 65mL of ethanol as lye for adjusting acidity and alkalinity.

[0075] Dissolve 3.27g of sodium borohydride in 30mL of diethylene glycol, add 0.36g of polyvinylpyrrolidone (dispersant), and 3 drops of the above lye to prepare a reducing solution. The dosage of the reducing agent sodium borohydride is 0.34 times of the total mass of the tin salt and the bismuth salt.

[0076] Ventil...

Embodiment 3

[0086] The preparation of a low-temperature sintered shell-type tin-bismuth alloy powder Cu@Sn-52Bi comprises the following steps:

[0087] The first step, co-reduction to prepare alloy precursors

[0088] The 3.8g SnCl that mass ratio is 1:1.53 2 , 5.82g Bi(NO 3 ) 3 ·5H 2 O was dissolved in 63mL of diethylene glycol, and 0.75g of polyvinylpyrrolidone was added. The amount of polyvinylpyrrolidone accounted for 7.8% of the total mass of the tin salt and bismuth salt, and stirred until the solution was clear and transparent, as the mother liquor.

[0089] Dissolve 3.24g of sodium hydroxide in 65mL of ethanol as lye for adjusting acidity and alkalinity.

[0090] Dissolve 3.27g of sodium borohydride in 30mL of diethylene glycol, add 0.36g of polyvinylpyrrolidone (dispersant), and 3 drops of the above lye (to inhibit the decomposition of sodium borohydride) to prepare a reducing solution. The dosage of the reducing agent sodium borohydride is 0.34 times of the total mass of th...

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Abstract

The invention discloses a low-temperature sintered shell-type tin-bismuth alloy powder, which is composed of an inner core and an outer shell layer. The inner core is a spherical powder with a size of 0.1-4 μm. The inner core is selected from copper powder, silver powder, aluminum powder, At least one of alumina powder or silica powder; the shell layer is a tin-bismuth alloy layer with a thickness of 0.1-1 μm, and the mass ratio of tin-bismuth in the tin-bismuth alloy layer is 40:60-60:40 , the shell layer is complete and dense, with high sphericity. The low-temperature sintered nuclei-shell tin-bismuth alloy powder prepared by the invention has low sintering temperature, high temperature resistance and oxidation resistance, and the melting temperature of the alloy surface layer is 139°C, which can be sintered at low temperature. During the sintering process, the seed ball and the tin-bismuth alloy shell form a new Ternary alloys and intermetallic compounds can increase the melting point of the circuit and improve the stability of the circuit.

Description

technical field [0001] The invention belongs to the technical field of materials for flexible printed circuits, and in particular relates to a low-temperature sintered shell-type tin-bismuth alloy powder and its preparation method and application. Background technique [0002] With the high-speed iteration of electronic products, the production process of printed circuit board (PCB), which is the core component of electronic products, is also constantly improving. From the early single-layer boards and double-layer boards to the current multi-layer boards, PCBs continue to develop in the direction of miniaturization and high integration. However, the traditional PCB production process is complicated, the cycle is long, and the etching process is seriously polluted, which is not only inefficient, but also accompanied by high environmental costs. Finding an efficient and green PCB production process has become an urgent problem to be solved in the PCB industry. [0003] At p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/17B22F1/18B22F1/065B22F9/24C23C18/48
CPCB22F9/24C23C18/48B22F1/17
Inventor 方斌杨哲涵胡紫嫣张震杨向民梁莹
Owner EAST CHINA UNIV OF SCI & TECH
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