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Contact type self-sealing temperature control type glue dispensing device

A dispensing device and self-sealing technology, applied in the field of dispensing machines, can solve problems such as needle tail glue and glue leakage

Inactive Publication Date: 2021-07-13
NO 24 RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that after dispensing, the residual pressure of the needle tube will cause the needle to be prone to glue tailing and glue leakage.

Method used

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  • Contact type self-sealing temperature control type glue dispensing device
  • Contact type self-sealing temperature control type glue dispensing device

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Experimental program
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Embodiment Construction

[0020] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0021] Such as figure 1 and figure 2 As shown, the present invention includes a rubber storage cylinder 1, a ball 2, a connecting pipe 3, a conductive rubber needle tube 4, a piston 5, and a pressure supply part. On the movement axis, the side wall of the rubber storage cylinder 1 is provided with a glue inlet 6, and the lower end of the rubber storage cylinder 1 is provided with a circular glue outlet hole 7, and the ball 2 is located in the rubber storage cylinder 1, and the diameter of the ball 2 is smaller than the outlet The diameter of the glue hole 7 is large, the lower part of the ball 2 is supported on the hole wall of the glue outlet 7, the conductive rubber needle tube 4 is cylindrical, the piston 5 fits in the conductive rubber nee...

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PUM

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Abstract

The invention provides a contact type self-sealing temperature control type glue dispensing device which comprises a glue storage barrel, a ball, a connecting pipe, a conductive glue needle pipe, a piston and a pressure supply part. The upper end of the glue storage barrel is used for being fixed to a vertical movement shaft of a three-axis mechanical arm of a glue dispensing machine, a glue inlet is formed in the side wall of the glue storage barrel, and a circular glue outlet hole is formed in the lower end of the glue storage barrel. The ball is located in the glue storage barrel, the diameter of the ball is larger than that of the glue outlet hole, and the lower portion of the ball is supported on the hole wall of the glue outlet hole. The conductive glue needle pipe is cylindrical, the piston is matched in the conductive glue needle pipe, and an air inlet is formed in the upper end of the conductive glue needle pipe and used for being connected with the pressure supply part. The pressure supply part provides air pressure for the part, located on the upper side of the piston, of an inner cavity of the conductive glue needle pipe through the air inlet, an outlet is formed in the lower end of the conductive glue needle pipe, the lower end of the connecting pipe is connected with the glue inlet, and the upper end of the connecting pipe is connected with the outlet. And the glue storage barrel is not easy to leak glue and tail glue.

Description

technical field [0001] The invention belongs to the technical field of dispensing machines, in particular to a contact-type self-sealing temperature-controlled dispensing device. Background technique [0002] The placement process in the integrated circuit packaging process is to fix the back of the chip on the dispensing surface by bonding the back of the chip with epoxy resin conductive adhesive, which is an extremely important and indispensable process in the packaging process. The conductive adhesive used in the patch process is a special adhesive with both adhesion and conductivity before curing. In the SMT process, the chip is fixed on the dispensing surface by dispensing glue first, and then the chip is fixed on the dispensing surface, and then the conductive adhesive is hardened by heating and curing to form a stable bond between the chip and the dispensing surface. [0003] At present, the MUSASH I dispensing machine is mostly used. The principle of dispensing is t...

Claims

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Application Information

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IPC IPC(8): B05C5/02B05C11/10B05C11/11
CPCB05C5/0208B05C5/0225B05C11/1002B05C11/1042B05C11/11
Inventor 谈侃侃李金龙
Owner NO 24 RES INST OF CETC
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