PCB (Printed Circuit Board) and potential connection side surface metallization process thereof

A PCB board and metallization technology, which is applied in the field of metallization technology on the side of the PCB board and its potential connection, can solve the problems affecting the normal operation of the circuit board, the separation of the copper layer from the circuit board, etc., and achieve a simple manufacturing method and high production efficiency. Effect

Active Publication Date: 2021-06-22
勤基电路板(深圳)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the related technologies mentioned above, the inventor believes that: when the circuit board is actually connected to the socket, the copper layer on the substrate in the circuit board is easily squeezed by the edge of the socket opening, causing the copper layer to separate from the circuit board , thereby affecting the normal operation of the circuit board

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  • PCB (Printed Circuit Board) and potential connection side surface metallization process thereof
  • PCB (Printed Circuit Board) and potential connection side surface metallization process thereof
  • PCB (Printed Circuit Board) and potential connection side surface metallization process thereof

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Embodiment Construction

[0038] The following is attached Figure 1-5 The application is described in further detail.

[0039] The first aspect: the embodiment of the present application discloses a PCB board.

[0040] refer to Figure 5 , a PCB board includes a substrate 1, a substrate 1, two circuit layers 11 respectively arranged on opposite sides of the substrate 1, and a connector connected to the two circuit layers 11. In this embodiment, the connection The component is the first plating layer 5 formed by copper plating, the opposite ends of the first plating layer 5 are respectively connected to the two circuit layers 11, and the first plating layer 5 is attached to the side wall of the substrate 1 close to the socket.

[0041] In the second aspect, the embodiment of the present application discloses a metallization process for the potential side of a PCB board.

[0042] A metallization process on the side of the PCB board connected to the potential, refer to figure 1 , which includes the f...

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Abstract

The invention relates to the technical field of circuit boards, and relates to a PCB and a potential connection side surface metallization process thereof. The PCB comprises a base material, two circuit layers respectively arranged on two opposite sides of the base material, and a connecting piece arranged on one end, facing a socket, of the base material, wherein two opposite ends of the connecting piece are respectively connected with the two circuit layers. Through the circuit layer and the connecting piece which are connected together, when the circuit board is inserted into the socket, if the circuit board is not aligned with the opening of the socket, the connecting piece firstly abuts against the edge of the opening of the socket, and then the circuit board is inserted into the socket, so that the condition that the circuit layer is in contact with the edge of the opening of the socket is avoided, and the circuit layer is protected; the condition that the circuit layer is separated from the base material is avoided, so that the circuit board can work normally after being inserted into the socket, and the applicability of the circuit board is further improved.

Description

technical field [0001] The present application relates to the field of circuit boards, in particular to a PCB board and a metallization process for its potential-connected side. Background technique [0002] At present, PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. On printed circuit boards, Copper will be plated on the surface of the substrate, and copper will connect the components on the substrate to each other. It is a good material for forming the surface pattern of the conductive path of the printed circuit board. [0003] An existing circuit board includes a base material and copper layers electroplated on opposite sides of the base material. Circuits are arranged on the copper layer. When the circuit board is installed, the circuit board is inserted from the socket ...

Claims

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Application Information

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IPC IPC(8): H05K1/14
CPCH05K1/14
Inventor 宁娜张玉财许剑明黄军辉钟秀霞卢龙
Owner 勤基电路板(深圳)有限公司
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