Quick high-temperature glue pasting device for memory bank connector

A technology for connectors and memory sticks is applied in the field of high-temperature adhesive devices for quick sticking of memory stick connectors. Strong and simple structure

Pending Publication Date: 2021-06-22
FCI CONNECTORS DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, the high-temperature-resistant adhesive tape is pasted by hand with high-temperature-resistant adhesive tape. This method has low paste efficiency, and the pasting effect is not good, which will reduce the protective effect of the high-temperature-resistant adhesive tape on the memory module connector.

Method used

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  • Quick high-temperature glue pasting device for memory bank connector
  • Quick high-temperature glue pasting device for memory bank connector
  • Quick high-temperature glue pasting device for memory bank connector

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Embodiment Construction

[0083] The specific embodiment of the present invention will be further described below in conjunction with accompanying drawing:

[0084] Such as figure 1 and 2 As shown, the present embodiment provides a device for quickly attaching high-temperature glue to a memory stick connector, and the device includes a bottom plate 1, a memory stick connector rotation mechanism 2 for feeding materials arranged on the bottom plate 1, and a memory stick connector The grasping mechanism 3, the memory stick connector distributing mechanism 4 and the high temperature glue sticking mechanism 5. In this embodiment, the memory stick connector grasping mechanism 3, the memory stick connector distributing mechanism 4 and the high temperature glue sticking mechanism 5 are arranged on the outside of the memory stick connector rotation mechanism 2, and the memory stick connection The device grabbing mechanism 3 is used to grab the memory stick connector from the memory stick connector rotation me...

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PUM

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Abstract

The invention provides a quick high-temperature glue pasting device for a memory bank connector. The quick high-temperature glue pasting device comprises a bottom plate, a memory bank connector rotating mechanism, a memory bank connector grabbing mechanism, a memory bank connector distributing mechanism and a high-temperature glue pasting mechanism. The device is simple in structure, rotary feeding can be achieved, and meanwhile machining of equipment arranged on the periphery of the rotary disc is met; the clamping mechanism is matched with the clamping assembly on each mounting seat, so that clamping is realized; according to the invention, the grabbing mechanism is utilized to grab the memory bank connectors to the material distribution mechanism to realize material distribution, and the connectors after material distribution are grabbed to the memory bank connector mounting seat and are conveyed to a high-temperature glue pasting process, and the material distribution mechanism is utilized to separate the plurality of memory bank connectors into single connectors. Material distribution is achieved in a clamping and moving combined mode; the high-temperature glue pasting mechanism can achieve warm glue roll fixing, high-temperature glue flattening, high-temperature glue conveying and high-temperature glue clamping, and the high-temperature glue is pasted to the connector through the high-temperature glue clamping mechanism.

Description

technical field [0001] The invention relates to the technical field of connectors, in particular to a high-temperature adhesive fast-attaching device for memory stick connectors. Background technique [0002] A connector is a device used to connect two active devices to transmit current or signals. The connector mainly includes a plastic shell and a connector terminal. The memory stick is a computer component that the CPU can address through the bus and perform read and write operations, and the memory stick connector is a connector for inserting the memory stick. [0003] The production of the memory connector requires high-temperature processing. Before the high-temperature process, it is necessary to paste the high-temperature adhesive tape on the memory connector to protect the part of the structure of the memory connector that is not resistant to high temperature, so as to ensure that the high-temperature process can not withstand the high temperature. Affects the stab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/00H01R43/20
CPCH01R43/00H01R43/20
Inventor 欧金洋孔德昊
Owner FCI CONNECTORS DONGGUAN
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