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A kind of high thermal conductivity aluminum nitride ceramic and preparation method thereof

A technology of aluminum nitride ceramics and high thermal conductivity, which is applied in the field of ceramic materials, can solve the problems of not being able to take into account performance at the same time, and achieve the effects of good chemical stability and thermal stability, improved adhesion, and small internal stress

Active Publication Date: 2022-07-05
FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, in view of the above content, the present invention provides a high thermal conductivity aluminum nitride ceramic and its preparation method to solve the problem that the existing aluminum nitride ceramics only have outstanding performance in one aspect such as thermal conductivity and strength, and cannot take into account all aspects at the same time performance problem

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A preparation method of high thermal conductivity aluminum nitride ceramics, comprising the following steps:

[0035] (1) One-time ball milling: add aluminum nitride powder, calcium carbonate, lithium nitrate and ethanol into the ball mill for one-time ball milling, ball-mill dispersion for 6 hours, dry and sieve after ball-milling to obtain intermediate powder, described aluminum nitride powder, The mass ratio of calcium carbonate and lithium nitrate is 85:5:3, and the mass of ethanol is 60% of the aluminum nitride powder;

[0036] (2) calcination: in a nitrogen atmosphere, the intermediate powder obtained in step (1) was calcined at 950° C. for 90 min, and sieved to obtain a mixed powder;

[0037] (3) Secondary ball milling: add the mixed powder, molybdenum disulfide, solvent, sodium polyacrylate, dimethyl phthalate and binder obtained in step (2) into the ball mill for secondary ball milling, and the ball milling time is 10h ;

[0038] The added amount of the molyb...

Embodiment 2

[0045] A preparation method of high thermal conductivity aluminum nitride ceramics, comprising the following steps:

[0046] (1) One-time ball milling: add aluminum nitride powder, calcium carbonate, lithium nitrate and ethanol into the ball mill for one-time ball milling, disperse by ball milling for 10 hours, dry and sieve after ball milling to obtain intermediate powder, the aluminum nitride powder, The mass ratio of calcium carbonate and lithium nitrate is 88:6:5, and the mass of ethanol is 70% of the aluminum nitride powder;

[0047] (2) calcination: in a nitrogen atmosphere, the intermediate powder obtained in step (1) was calcined at 1000° C. for 60 min, and sieved to obtain a mixed powder;

[0048] (3) secondary ball milling: adding the mixed powder, molybdenum disulfide, solvent, fish oil, diethyl phthalate and binder obtained in step (2) into the ball mill for secondary ball milling, and the ball milling time is 15h;

[0049] The added amount of the molybdenum disul...

Embodiment 3

[0056] A preparation method of high thermal conductivity aluminum nitride ceramics, comprising the following steps:

[0057] (1) One-time ball milling: add aluminum nitride powder, calcium carbonate, lithium nitrate and ethanol into the ball mill for one-time ball milling, ball-mill dispersion for 15 hours, dry and sieve after ball-milling to obtain intermediate powder, described aluminum nitride powder, The mass ratio of calcium carbonate and lithium nitrate is 90:8:6;

[0058] (2) calcination: in a nitrogen atmosphere, the intermediate powder obtained in step (1) is calcined at 1050° C. for 30 min, and sieved to obtain a mixed powder;

[0059] (3) secondary ball milling: adding the mixed powder obtained in step (2), molybdenum disulfide, solvent, polyethylene glycol 400, plasticizer and binder into the ball mill for secondary ball milling, and the ball milling time is 20h;

[0060] The added amount of the molybdenum disulfide is 50% of the mass of the mixed powder, the solv...

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Abstract

The invention relates to the technical field of ceramic materials, and provides a high thermal conductivity aluminum nitride ceramic and a preparation method thereof. The preparation method includes the following steps: (1) primary ball milling; (2) calcination; (3) secondary ball milling; (4) (5) Tape forming; (6) Isostatic pressing; (7) Debinding; (8) Hot pressing and sintering to obtain aluminum nitride ceramics with a thermal conductivity of 200-230W / (m·K ), the flexural strength is 470-540MPa, and the bulk density is 3.3-3.5g / cm, which solves the problem that the existing aluminum nitride ceramics only have outstanding performance in one aspect such as thermal conductivity and strength, and cannot take into account all aspects of performance at the same time. question.

Description

technical field [0001] The invention relates to the technical field of ceramic materials, in particular to a high thermal conductivity aluminum nitride ceramic and a preparation method thereof. Background technique [0002] Ceramic substrate materials are mainly aluminum nitride (AlN), aluminum oxide (Al 2 0 3 ), beryllium oxide (BeO), silicon carbide (SiC), boron nitride (BN), silicon nitride (Si 3 N 4 )Wait. Al 2 O 3 As a traditional substrate material, ceramics have low thermal conductivity, and the coefficient of linear expansion does not match that of Si, which can easily cause thermal mismatch between the substrate and the Si sheet. Although the thermal conductivity of BeO ceramics is high, it can reach 310W / ( m K), but its raw materials are highly toxic and expensive to produce, and have been phased out gradually. Although the SiC substrate has high thermal conductivity, it has poor insulation performance; BN is difficult to sinter densely, the preparation proc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/581C04B35/622C04B35/638C04B35/645
CPCC04B35/581C04B35/622C04B35/638C04B35/645C04B2235/6025C04B2235/6562C04B2235/6567C04B2235/77C04B2235/96C04B2235/9607
Inventor 杨大胜施纯锡冯家伟
Owner FUJIAN HUAQING ELECTRONICS MATERIAL TECH
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