High-density high-frequency multilayer flexible circuit board

Abstract

The invention discloses a high-density high-frequency multilayer flexible circuit board which comprises a circuit board body, a drying agent and a filter screen. A first elastic rubber pad and a supporting column are fixed to the top and the bottom of the edge of the circuit board body respectively, and the drying agent is arranged in an inner cavity. According to the high-density high-frequency multilayer flexible circuit board, fixing rods and fixing frames are arranged so that the strength of the circuit board body is improved, the probability that the circuit board body is bent and damaged is reduced, meanwhile, the supporting column is arranged, the supporting column can enable the circuit board body to be in a suspended state when the circuit board body is installed, and heat dissipation of the circuit board body is facilitated; and the drying agent is arranged so that moisture can be absorbed by the drying agent when the circuit board body is used, a short circuit of the circuit board body is avoided, heat generated when the circuit board body works can be absorbed by the drying agent so that moisture in the drying agent can be removed, and the drying agent can be used repeatedly and circularly.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a high-density and high-frequency multilayer flexible circuit board. Background technique [0002] The circuit board is an insulating board with connected conductors, on which electronic components are fixed and connected to form a circuit. Multi-layer flexible circuit board is made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness, good bending, and excellent insulation performance. . [0003] However, when the existing circuit board is installed, the distance between the circuit board and the chassis is small, resulting in poor heat dissipation of the circuit board, and at the same time in a humid environment, it is easy to cause a short circuit of the circuit board, reducing the life of the circuit board The strength of the circuit board is not high, and it is easily damaged by external...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-density high-frequency multi-layer flexible circuit board to solve the above-mentioned background technology. When the existing circuit board is installed, the distance between the circuit board and the chassis is small, resulting in the heat dissipation effect of the circuit board. At the same time, in a humid environment, it is easy to cause a short circuit of the circuit board, which reduces the life of the circuit board. At the same time, the strength of the circuit board is not high, and it is easy to be damaged by external forces.

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