Verification method and system for ICT test platform

Abstract

The invention discloses a verification method and system for an ICT test platform. The method comprises the following steps: providing a needle point verification plate, and forming a plurality of patterns on the surface of the needle point verification plate, wherein the shapes, sizes and positions of the plurality of patterns are respectively corresponding to the shapes, sizes and positions of a plurality of bonding pads on the PCB; clamping and fixing the needle point verification plate through a clamp; and aligning a test platform provided with a plurality of probes with the probe point verification plate, controlling the plurality of probes to abut against the probe point verification plate, forming a plurality of probe prints on the probe point verification plate, and verifying the positions of the probes on the test platform according to the positions of the plurality of probe prints, wherein the plurality of graphs comprise a plurality of categories of graphs, and different categories of graphs are different in size and color. According to the invention, the position of the probe on the ICI test platform can be verified, and the PCB is prevented from being scratched to cause the waste of the PCB.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a verification method and system for an ICT test platform. Background technique [0002] PCBA is a combination of PCB (Printed Circuit Board, printed circuit board) and components. When PCBA is tested on the ICT (In Circuit Tester, online circuit test) test platform, each pin point of the ICT test platform is required to be in contact with the PCBA. The point PAD (that is: pad) is in good contact. Only in this way can the ICT test be effectively completed, which requires the pin point to be within the PAD area. At present, when verifying the position of the pin point of the ICT test platform, a piece of PCB is usually selected to do it, and the blue film is pasted on the PCB, put into the fixture and sucked together to determine whether the position of the pin point is within the PAD area. When the position of the pin point of the ICT test platform is shifted, if the pin poi...

AI Technical Summary

Problems solved by technology

At present, when verifying the position of the pin point of the ICT test platform, a piece of PCB is usually selected to do it, and the blue film is pasted on the PCB, put into the fixture and sucked together to determine whether the position of the pin point is within the PAD area. When the position of the pin point of the ICT test platform is shifted, if the pin point is outside the PAD area on the PCB, the PCB will be scratched and the PCB will be wasted

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