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Multilayer circuit board convenient to fix and install

A multi-layer circuit and mounting board technology, applied in the field of circuit boards, can solve the problems of inconvenient installation and fixation of multi-layer circuit boards, unsatisfactory use requirements, and low work efficiency.

Pending Publication Date: 2021-04-27
深圳市瑞邦创建电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing multi-layer circuit boards that are convenient for fixed installation are not easy to install and fix, and a single circuit board cannot be disassembled and repaired. It takes a lot of time for the staff to disassemble and assemble as a whole, and the work efficiency is low; Usage requirements

Method used

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  • Multilayer circuit board convenient to fix and install
  • Multilayer circuit board convenient to fix and install
  • Multilayer circuit board convenient to fix and install

Examples

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that ...

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Abstract

The invention discloses a multi-layer circuit board convenient to fix and install, and the circuit board comprises a bottom plate; side plates are installed on the two sides of the upper surface of the bottom plate, first through holes and installation grooves are respectively formed in the outer walls of the two sides of the side plates, convex blocks are installed in the installation grooves, and the convex blocks are installed on the outer wall of one side of a U-shaped installation plate; a first connecting plate is arranged at the top of the U-shaped mounting plate, a first connecting column is mounted at the bottom of the first connecting plate, and a third magnet block is mounted at the bottom end of the first connecting column. According to the invention, the problem that the existing multilayer circuit board is inconvenient to install and fix is solved; according to the invention, the single circuit board body can be conveniently mounted and dismounted, the single circuit board body can be conveniently dismounted and overhauled, a lot of dismounting and mounting time is saved for workers, the working efficiency is improved, the situation that the circuit board body is liable to loosen after being fixed for a long time can be avoided, and the practicability is high.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a multilayer circuit board which is convenient for fixed installation. Background technique [0002] The names of circuit boards are: circuit board, PCB board, aluminum substrate, high frequency board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in the mass production of fixed circuits and the optimization of the layout of electrical appliances; with the rapid development of electronic technology, the requirements for electronic products are getting higher and higher, and the functions are more and more. The integration level of the circuit board is getting higher and higher. Correspondingly, the design requirements for the circuit board are also getting higher and higher. [0003] However, the existing multi-laye...

Claims

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Application Information

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IPC IPC(8): H05K7/14
CPCH05K7/14H05K7/1401
Inventor 阳家敏
Owner 深圳市瑞邦创建电子有限公司
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