Multi-chip mounting structure and manufacturing method thereof

Abstract

The invention provides a multi-chip mounting structure and a preparation method. The preparation includes: mounting a plurality of chips on a substrate, preparing a filling auxiliary layer on the chip to form a cavity, corresponding to the cavity having a gas inlet and a gas outlet, Apply underfill material at the gas inlet, apply negative pressure at the gas outlet, and based on the air pressure, the underfill material flows into the bottom of the chip to form an underfill. For the packaging structure of multiple chip modules, the present invention builds a cavity between the chip to be packaged and the substrate, applies an underfill material at the gas inlet, and applies negative pressure at the gas outlet, so that the underfill is compressed under the action of air pressure. Inserting into the bottom of the chip can reduce the difficulty of filling the underfill of the multi-chip structure, and is conducive to solving the problem of filling air bubbles. It can also solve the problems of difficult placement of the glue filling head, complicated glue filling process and great influence on the structure of the previous steps in the structure of multi-chip small pitch. The invention has simple process and can also solve the problem of filling on demand when multiple chips are difficult to integrate.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a mounting chip structure and a preparation method for the mounting chip structure. Background technique [0002] The bottom mounting technology of the chip is the main way for the chip to be connected to the terminal. In order to prevent the large stress difference between the chip and the substrate from causing the solder balls to break, it is often necessary to fill the bottom glue between the chip and the substrate. [0003] However, with the development of technology, the number of chips has increased and the size has become larger, and the number of chips mounted on the surface of the current module is large. At present, in the prior art, it is difficult to perform bottom filling according to actually needed chips among multiple chips, and not to fill unnecessary chips. In addition, it is very difficult for the underfill to completely occupy the space at...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a chip mount structure and a method for preparing the chip mount structure, which are used to solve the problem of the difficulty in forming an effective underfill at the bottom of a multi-chip structure in the prior art. The packaging structure of the chip integration is difficult to fill, the process is complicated, the influence between steps is large, and it is difficult to effectively realize on-demand filling.

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