Assembling device for producing semiconductor light-emitting element

A technology for light-emitting components and assembling devices, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of inability to assemble semiconductors uniformly, low work efficiency, etc., to prevent bending, improve work efficiency, and prevent damage. Effect

Inactive Publication Date: 2021-04-23
李丽蓉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide an assembly device for the production of semiconductor light-emitting elements, to solve the problems in the above-mentioned background technology that semiconductors cannot be assembled uniformly and work efficiency is low

Method used

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  • Assembling device for producing semiconductor light-emitting element
  • Assembling device for producing semiconductor light-emitting element
  • Assembling device for producing semiconductor light-emitting element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Example 1: See Figure 1-6, an assembly device for the production of semiconductor light-emitting elements, comprising a base plate 1 and a support plate 13, the two sides of the top of the base plate 1 are fixedly connected with support plates 13, the top of the support plate 13 is provided with a top plate 9, and one side of the support plate 13 is provided with The dust removal mechanism 4, the inside of the bottom plate 1 is provided with a limit mechanism 2, the top of the bottom plate 1 is provided with a workbench 15, a buffer structure 3 is provided between the bottom plate 1 and the workbench 15, and the top of the workbench 15 is provided with a pressure plate 5, the workbench Limiting grooves 17 are arranged on both sides of the inside of 15, a feeding mechanism 16 is arranged at one end of the top of the bottom plate 1, and a uniform-speed lifting mechanism is arranged at the bottom of the top plate 9;

[0036] see Figure 1-6 , an assembly device for the p...

Embodiment 2

[0039] Embodiment 2: The limit mechanism 2 is composed of a connecting column 201, a moving sleeve 202, a servo motor 203, a support rod 204, a connecting block 205, a limit rod 206 and a screw shaft 207. The screw shaft 207 is arranged inside the bottom plate 1, and the screw The outside of the shaft 207 is provided with a moving sleeve 202, the top of the moving sleeve 202 is fixedly connected with a connecting column 201, one side of the connecting column 201 is fixedly connected with a connecting block 205, and one side of the connecting block 205 is fixedly connected with a limit rod 206, a support rod 204 is fixedly connected to both sides of the inner bottom of the bottom plate 1, and one side of the support rod 204 is provided with a servo motor 203, and the model of the servo motor 203 is 80HB-02430;

[0040] The threads on both sides of the screw shaft 207 are opposite, and the servo motor 203 is fixedly connected to the screw shaft 207 through a coupling;

[0041] S...

Embodiment 3

[0042] Embodiment 3: The buffer structure 3 is composed of a sleeve 301, a sleeve rod 302, a spring groove 303, a buffer spring 304 and a support column 305. The sleeve 301 is fixedly connected to the top of the bottom plate 1, and the sleeve rod 302 is fixedly connected to the bottom of the workbench 15. At the four corners of the end, one side of the sleeve rod 302 is provided with a spring groove 303, and the inside of the spring groove 303 is provided with a buffer spring 304. 15 both ends of the bottom;

[0043] The sleeve 301 is socketed on the bottom end of the sleeve rod 302, and the sleeve rod 302 is symmetrically distributed with respect to the vertical center line of the workbench 15;

[0044] Specifically, such as figure 1 and Figure 6 As shown, when the pressing plate 5 assembles the semiconductor on the top of the workbench 15, the pressing plate 5 needs to squeeze the semiconductor. When the pressing plate 5 squeezes the semiconductor, the workbench 15 will s...

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Abstract

The invention discloses an assembling device for producing semiconductor light-emitting element and particularly relates to the technical field of semiconductor production equipment; the assembling device comprises a bottom plate and supporting plates, the two sides of the top end of the bottom plate are fixedly connected with the supporting plates, the top ends of the supporting plates are provided with a top plate, and one side of each supporting plate is provided with a dust removal mechanism; and a limiting mechanism is arranged in the bottom plate. By arranging supporting blocks, a hydraulic air cylinder, a telescopic rod, a rubber pad and a push plate, after a semiconductor at the top end of the workbench is assembled, the hydraulic air cylinder at the top end of the supporting block is started, the hydraulic air cylinder drives the push plate through the telescopic rod to push out the semiconductor assembled at the top end of the workbench, and the rubber pad is bonded to one end of the push plate; the rubber pad has elasticity and can protect the semiconductor, the semiconductor is prevented from being damaged when the push plate pushes the semiconductor out of the top end of the workbench; the structure is simple, the assembled semiconductor can be pushed out conveniently, and the assembling efficiency of the device can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor production equipment, in particular to an assembly device for the production of semiconductor light-emitting elements. Background technique [0002] With the development of society, more and more electronic devices need to use semiconductor light-emitting elements. Semiconductors can be used to generate, control, receive, transform, amplify signals and perform energy conversion. Semiconductor light-emitting elements need to be assembled when producing semiconductors However, there are still some problems in the existing assembly device for the production of semiconductor light-emitting elements. [0003] In the process of realizing the present invention, the inventors have found that at least the following problems in the prior art have not been resolved: [0004] (1) The traditional assembly device for the production of semiconductor light-emitting elements, the pressure plate cannot unifo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L33/00
CPCH01L21/67121H01L33/005
Inventor 李丽蓉
Owner 李丽蓉
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