Electroplating device

An electroplating device and electrode technology, applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve problems such as scattering, impact on electroplating quality and efficiency, and influence on electroplating effect of plated parts, so as to ensure uniformity and slow down the rolling speed of rods Effect

Inactive Publication Date: 2021-04-02
周孟林
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides an electroplating device, which solves the problem that the traditional electroplating equipment clamps and fixes the rod to be electroplated, so that the clamped part cannot be penetrated by the electroplating solution, so tha

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] like Figure 1-2As shown, the present invention provides a technical solution: an electroplating device, including an electroplating generating tank 1, the left and right sides of the electroplating generating tank 1 are provided with adjusting chute 2, and the vertical position inside the adjusting chute 2 is slidably connected There is an electrode carrying mechanism 3, the front and back of the inside of the adjustment chute 2 are evenly and fixedly connected with the electrode rod 4, and the middle position of the inner bottom of the electroplating generating tank 1 is fixedly connected with a guide inner tank 5, and the inside of the guide inner tank 5 is fixed at a position close to the upper side A limiting baffle 6 is connected, and a motor drive shaft 7 is connected to the middle position inside the guiding inner tank 5 for rotation. The vortex generating mechanism 9 is uniformly provided with filter holes 10 on the surface of the limiting baffle 6 .

[0039] ...

Embodiment 2

[0041] like Figure 3-6 As shown, on the basis of Embodiment 1, the present invention provides a technical solution: an electroplating device, the electrode mounting mechanism 3 includes an electrode carrier plate 301, and the outer side of the electrode carrier plate 301 is rotatably connected with a moving slider 302, and the moving slider The block 302 is slidably connected with the inside of the adjustment chute 2 , and the surface of the top of the electrode carrier plate 301 is uniformly provided with an overturning groove 303 . Avoid the phenomenon of uneven plating caused by traditional clamping on rods, and at the same time ensure that the plated parts remain energized when they roll in the device.

[0042] The top surface of the electrode carrier plate 301 and the position between the turning grooves 303 are provided with a walking restriction groove 304, the inner rotation of the walking restriction groove 304 is connected with a walking shaft 305, and the middle po...

Embodiment 3

[0048] like Figure 7 As shown, on the basis of Embodiment 1 and Embodiment 2, the present invention provides a technical solution: an electroplating device, the vortex generating mechanism 9 includes a resistance-increasing stirring rod 91, and the outer side of the resistance-increasing stirring rod 91 is fixedly connected with a guide The arc plate 92 , the bottom surface of the resistance-increasing stirring rod 91 and the guiding arc plate 92 are all fixedly connected with the stirring carrying plate 8 . The lower part of the electrolyte is circulated and stirred, and the electrolyte forms a vortex structure, which increases the fluidity of the electrolyte and ensures the uniform distribution of ions in the electrolyte. At the same time, the vortex gathers the precipitates generated by electrolysis to avoid the influence of the precipitates on the electroplating.

[0049] The front of the resistance-increasing stirring rod 91 is uniformly provided with increasing and bloc...

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Abstract

The invention discloses an electroplating device and relates to the technical field of electroplating. The electroplating device comprises an electroplating generation tank; adjusting sliding groovesare formed in the left side and the right side of the interior of the electroplating generation tank; electrode carrying mechanisms are slidably connected to the vertical positions of the interiors ofthe adjusting sliding grooves; electrode rods are evenly and fixedly connected to the front faces and the back faces of the interiors of the adjusting sliding grooves; a guide inner tank is fixedly connected to the middle position of the bottom end in the electroplating generation tank; a limiting baffle is fixedly connected to the position, close to the upper portion, in the guide inner tank; amotor driving shaft is rotationally connected to the middle position in the guide inner tank; stirring carrying plates are evenly and fixedly connected to the outer surface of the motor driving shaft;vortex generating mechanisms are fixedly connected to the surfaces of the tops of the stirring carrying plates; and filtering holes are evenly formed in the surfaces of the limiting baffle. Accordingto the electroplating device, the phenomenon of uneven electroplating of a rod piece due to traditional clamping is avoided, and meanwhile it is guaranteed that an electroplated piece is kept in a powered-on state when rolling in the device.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, electrical conductivity, reflective properties, corrosion resistance and improve appearance. [0003] Such as Chinese invention publication number is: a kind of electroplating tank of CN108103561A, comprises main tank body, also comprises overflow tank, variable temperature tank and variable temperature pump, is provided with overflow port on the outer wall of main tank body, and overflow port communicates with overflow tank , the temperature-variable tank includes inlet, outlet and temperature-variabl...

Claims

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Application Information

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IPC IPC(8): C25D17/00C25D21/10C25D17/06C25D5/08C25D21/06C25D21/18
CPCC25D5/08C25D17/00C25D17/06C25D21/06C25D21/10C25D21/18
Inventor 周孟林
Owner 周孟林
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