Metal plate deposition mask for OLED pixel deposition

Abstract

An embodiment relates to a metal deposition mask for OLED pixel deposition, the deposition mask comprising a deposition region for forming a deposition pattern and a non-deposition region other than the deposition region, wherein: the deposition region comprises a plurality of effective portions arranged along the longitudinal direction to be spaced apart from each other and including multiple through-holes formed therethrough, and an ineffective portion other than the effective portions; the through-holes comprise a small surface hole formed through one surface of the deposition mask, a largesurface hole formed through the other surface of the deposition mask, which is opposite to the one surface, and a connection portion at which the boundaries of the small surface hole and the large surface hole are connected to each other; and the inner surface of at least one of the small surface hole and the large surface hole has a root mean square (RMS) surface roughness smaller than 150 nm.

Description

technical field [0001] Embodiments relate to an evaporation mask for a metal plate material used for OLED pixel evaporation. Specifically, the embodiment relates to a mask for evaporation capable of improving evaporation efficiency during evaporation of OLED pixels and a method for manufacturing the same. Background technique [0002] Display devices are being applied to various devices. For example, display devices are applied not only to small devices such as smartphones and tablet PCs but also to large devices such as televisions, monitors, and public displays. In particular, demand for ultra-high-definition UHD (Ultra High Definition) above 500PPI (Pixel Per Inch: Pixel Per Inch) is increasing recently, and high-definition display devices are being applied to small devices as well as large devices. Therefore, interest in techniques for achieving low power and high definition is also increasing. [0003] Commonly used display devices can be roughly classified into LCD ...

AI Technical Summary

Problems solved by technology

Therefore, there is a problem that, during the cleaning process, the vapor deposition device adhered to the inner wall of the through hole cannot be completely removed, but partially remains

However, it is limited to improve the surface roughness of the inner wall of the through hole only by changing the etching process conditions or etching solution conditions.

In addition, as the etching process conditions or etching solution conditions change, the size of the through holes will also change, which will lead to a decrease in the uniformity or precision of the through holes.

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