Bragg grating external cavity semiconductor laser module beam combining device

Abstract

The invention relates to a Bragg grating external cavity semiconductor laser module beam combining device, and the device comprises at least one light emitting module; the light emitting module comprises at least two light emitting units; at least one conduction optical fiber which is arranged on an output light path of the light-emitting module; a Bragg grating is arranged on an output light pathof the conduction optical fiber, the Bragg grating and the output end of the light-emitting module form an outer cavity, laser output through the conduction optical fiber vertically enters the incident end face of the Bragg grating, part of the laser is transmitted to serve as output light to be output, and part of the laser is reflected to serve as feedback light to return into the light-emitting module along the original path to achieve wavelength locking. An outer cavity is formed by one Bragg grating and a plurality of light-emitting modules, so that the cost of the beam combining deviceis reduced. The Bragg grating only feeds back part of light beams perpendicular to the incident end face, the output light power is improved, the light intensity fed back by the Bragg grating is ensured by limiting the core diameter of the conduction optical fiber and the distance between the conduction optical fiber and the Bragg grating, and a better locking effect is achieved.

Description

technical field [0001] The invention relates to the technical field of lasers, in particular to a beam combining device for a Bragg grating external cavity semiconductor laser module. Background technique [0002] High-power laser chips are often used as pump sources for solid-state lasers (such as thin slices, conductive fibers, and slab lasers), so their efficiency, spatial and spectral characteristics of laser emission determine the performance of solid-state lasers. High-power laser chips are also used in industrial fields such as direct material processing (e.g., surface treatment, welding, additive manufacturing, cutting), and show the potential to replace solid-state and guided fiber lasers. The increase in output power and brightness is the main driving force for the expansion of the application range of direct high-power laser chips. High-power, high-brightness laser output is usually obtained through beam combining technology. [0003] Laser beam combining techno...

AI Technical Summary

Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is that each light-emitting module in the existing semiconductor laser module beam combining device needs to use a corresponding Bragg grating for wavelength locking, which increases the number of Bragg gratings, resulting in an increase in the cost of the beam combining device, and The technical problems of high difficulty in adjustment and poor locking effect provide a beam combining device with lower cost and better locking effect

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