FOSB full-automatic bag opening and bagging device

Abstract

The invention discloses an FOSB (Front Opening Shipping Box) full-automatic bag opening and bagging device which comprises a discharging rack, a bag opening rack, a packaging bag storage rack, an FOSBplacing table, an FOSB horizontal pushing device, a drying agent bin, a humidity clamping bin, a grabbing device, a carrying device, a connecting opening device, a bag pressing transition device, a packaging conveying belt, a bag tail positioning device, a bottom suction cup device and an upper bag moving and sucking device. The discharging rack and the packaging bag storage rack are sequentiallyarranged on the two sides of the bag opening rack, and packaging bags are stacked on the packaging bag storage rack. The FOSB placing table, the FOSB horizontal pushing device, the drying agent bin,the humidity clamping bin and the carrying device are all installed on the discharging rack. The bag tail positioning device, the packaging conveying belt, the bottom suction cup device and the bag pressing transition device are sequentially installed on the bag opening rack in the same straight line direction. The whole mechanism is simple and compact, automatic bagging operation of the FOSB canbe achieved, and the bagging efficiency of the FOSB and the overall efficiency of FOSB packaging are improved.

Description

technical field [0001] The invention relates to the field of bagging for wafer packaging boxes, and more specifically, to a FOSB automatic bagging and bagging device. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. A wafer in the general sense basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is refined from ordinary silicon sand. After being dissolved, purified, and distilled, it supports a single crystal silicon rod. After the single crystal silicon rod is polished and sliced, it becomes a wafer. With the continuous development of integrated circuit manufacturing technology, the feature size of the chip is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is also increasing. To achieve multi...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of low production efficiency and low degree of automation caused by manual bagging of existing FOSB, and proposes a fully automatic bagging device for FOSB, which can realize the automatic bagging operation of FOSB, Improved bagging efficiency of FOSB and overall efficiency of FOSB packaging

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