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Packaging equipment for thick-film chip resistor

A chip resistor and packaging equipment technology, which is applied in the manufacture of encapsulated/cased resistors, etc., can solve the problem of inability to package two chip resistors, and achieve the effect of improving reliability and avoiding mutual friction.

Inactive Publication Date: 2021-03-02
江西昶龙科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that the packaging equipment for thick film chip resistors in the prior art cannot pack two chip resistors in the same hole of the carrier tape.

Method used

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  • Packaging equipment for thick-film chip resistor
  • Packaging equipment for thick-film chip resistor
  • Packaging equipment for thick-film chip resistor

Examples

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Effect test

Embodiment 1

[0041] Such as Figure 2 to Figure 7 As shown, the packaging equipment for thick film chip resistors in this embodiment includes a vibration plate 100, a resistance track 200, a carrier track 300, a packaging mechanism 400, a film conveying assembly 500 and a manipulator 600;

[0042] The vibrating plate 100 is connected to the resistance track 200, the resistance track 200 and the film conveying assembly 500 are respectively located on both sides of the carrier track 300, the resistance track 200 is parallel to the carrier track 300, and the packaging mechanism 400 is installed on the carrier track 300; in this embodiment The vibrating plate 100, resistance track 200, carrier tape track 300 and packaging mechanism 400 involved are consistent with the prior art;

[0043] Such as Figure 8 with Figure 9 As shown, the film conveying assembly 500 includes a driving roller 510, a driven roller 520, a backing plate 530 and two sets of guide rollers 540, the film roll is installe...

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Abstract

The invention discloses packaging equipment for a thick-film chip resistor. The packaging equipment comprises a vibrating disc, a resistor track, a carrier tape track, a packaging mechanism, a thin film conveying assembly and a manipulator, the vibrating disk is connected with a resistance track, the resistance track is parallel to the carrier tape track, and the packaging mechanism is installed on the carrier tape track; the thin film conveying assembly conveys a strip-shaped thin film to move forwards, and the strip-shaped thin film is parallel to the carrier tape track; the mechanical arm comprises a basic platform, a moving platform, a first air cylinder, a resistor grabbing assembly and a film grabbing assembly. The moving platform and the first air cylinder are both installed on thebasic platform, the first air cylinder drives the moving platform to horizontally move, and the moving direction of the moving platform is perpendicular to the carrier tape track. According to the packaging equipment for the thick-film chip resistors, the thin-film grabbing assembly is linked with the resistor grabbing assembly, the thin-film grabbing assembly can insert one thin-film piece between the two chip resistors in time, the two chip resistors in the same hole are separated by the thin-film piece, and mutual friction between the two chip resistors is avoided.

Description

technical field [0001] The invention relates to the field of packaging equipment, in particular to a packaging equipment for thick-film chip resistors. Background technique [0002] figure 1 It is a packaging equipment for thick film chip resistors in the prior art (also known as a braiding machine or a braiding packaging machine), mainly including a vibrating plate, a resistance track, a carrier track, a packaging mechanism and a manipulator. The vibrating plate packs a chip resistor Arrange one by one on the resistance track, and the resistance track advances with the arranged chip resistors; the carrier tape track transports the carrier tape forward, and the manipulator grabs the chip resistors on the resistance track one by one and fills them into the holes of the carrier tape. The packaging mechanism encapsulates the cover tape and the carrier tape; the chip resistor is generally in the shape of a cuboid, and the hole shape of the carrier tape is consistent with the sh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/02
CPCH01C17/02
Inventor 贾碧溪帅晓晴田空圣朱其乐李国武洪志斌
Owner 江西昶龙科技有限公司
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