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A wafer carrier automatic unscrewing device

A carrier and wafer technology, applied in manufacturing tools, metal processing equipment, metal processing, etc., can solve the problems of time-consuming and labor-intensive screw removal, material tray or internal wafer damage, and low work efficiency, so as to avoid exceeding the stroke, Ensure accuracy, reduce pollution effect

Active Publication Date: 2021-04-16
SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic unscrewing device for wafer carriers to solve the problem of time-consuming and laborious unscrew unloading during manual unloading, low work efficiency, and easy handling of trays or internal wafers. Technical issues causing damage

Method used

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  • A wafer carrier automatic unscrewing device
  • A wafer carrier automatic unscrewing device
  • A wafer carrier automatic unscrewing device

Examples

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Embodiment Construction

[0052] The present invention will be further described below in conjunction with specific examples. However, the uses and purposes of these exemplary embodiments are only used to illustrate the present invention, and do not constitute any form of limitation to the actual protection scope of the present invention, nor limit the protection scope of the present invention thereto.

[0053] Such as Figure 1 to Figure 4 As shown, this embodiment provides an automatic screw-down device for a wafer carrier, including a frame 1, on which a double-speed chain conveyor line, a carrier positioning mechanism and an automatic screw-down mechanism are provided, and the double-speed chain conveyor line A blocking cylinder 19 is provided. Two groups of blocking cylinders 19 are arranged along the conveying direction of the double-speed chain conveying line, and are respectively arranged at both ends of the carrier positioning mechanism. The automatic screw-down mechanism is located above the ...

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Abstract

The invention belongs to the technical field of wafer unloading, and provides an automatic unloading screw device for a wafer carrier, including a frame on which a double-speed chain conveying line, a carrier positioning mechanism and an automatic screw unloading mechanism are provided, and the double-speed chain conveying There are blocking cylinders on the line, and the blocking cylinders are respectively set at both ends of the carrier positioning mechanism. The automatic screw down mechanism is located above the carrier positioning mechanism; the carrier positioning mechanism includes a lifting pallet driven by a piston cylinder. Positioning pins, there are pallet limiters and cover plate limiters on both sides of the double-speed chain conveyor line. When in the positioning state, the wafer carrier is positioned and clamped between the lifting pallet, the tray limiter, and the cover plate limiter. space, and the tray limit block extends to the tray setting of the wafer carrier, and the cover plate limit plate extends to the cover plate setting. The present invention can realize the automatic unscrewing of the wafer carrier, not only realizes the effective replacement of manual labor, but also greatly improves the work efficiency, and avoids the occurrence of damage accidents to the material tray or the internal wafer.

Description

technical field [0001] The invention relates to the technical field of wafer unloading, in particular to an automatic screw unloading device for a wafer carrier. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. During the production and processing of wafers, according to the requirements of the processing technology, the wafers need to be arranged and placed in the wafer tray, and then the entire tray carrying the wafers is placed in a plasma etching machine for ICP etching. After the ICP etching process, the wafers are sequentially taken out from the wafer tray for subsequent AFM tests, etc. The process of taking the wafer out of the wafer tray is called wafer unloading. [0003] At present, the unloading operation of wafers in the tray is usually done manually. When unloading, the cover plate needs to be removed from the carrier plate first, and then...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P19/00B23P19/06
CPCB23P19/001B23P19/06
Inventor 王子龙李凯杰陈仁明李健曹智
Owner SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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