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Application of silica sol in field of microelectronics

A silica sol and microelectronics technology, applied in the field of microelectronics, can solve problems such as restrictions, dependence on imports of silica sol, and product performance that cannot meet the production needs of the microelectronics field, so as to reduce the risk of pollution, reduce the content of large particles in products, and reduce pollution. effect of chance

Inactive Publication Date: 2021-02-09
HEBEI UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] For a long time, the silica sol used in the microelectronics field has relied on imports. Due to the limitations of raw materials and processing technology, the domestic silica sol cannot meet the production needs of the microelectronics field.
Take Hubei Jinwei New Material Co., Ltd. as an example. Although it is a large-scale silica sol production enterprise in China, its products are mainly used in various refractory binders, coating industry, thin shell precision casting and paper industry. The performance cannot meet the production needs in the field of microelectronics

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The present invention will be described in detail below with reference to specific embodiments.

[0013] A kind of application of silica sol in the field of microelectronics, the silica sol is produced by Hubei Jinwei New Materials Co., Ltd., the raw material in the silica sol is Australian sand, and the company's production technology patent is adopted, and it is produced under closed automatic conditions ; Filling and packaging under 1000-level dust-free conditions; 0.2 micron filtration system is used for filtration. The production technology patents include the patent number 2019203478070, the invention-creation title of "A new type of reaction kettle for the production of silica sol" and the patent number 2015210184779, the invention-creation title of "A novel structure of nano-silica sol". technology.

[0014] Both the particle size distribution and the speed of the silica sol produced by the above process are used in the microelectronic multilayer wiring CMP to ...

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PUM

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Abstract

The invention discloses an application of silica sol in the field of microelectronics, and provides an application of novel silica sol in the field of microelectronics. According to the application ofthe silica sol in the field of microelectronics, the silica sol is produced by Hubei Jinwei New Material Co., Ltd., the raw material in the silica sol is Australian sand, and the silica sol is produced under a closed full-automatic condition; filling and packaging are conducted under a thousand-grade dust-free condition; and filtering is conducted by adopting a 0.2-micron filtering system. By improving the silica sol produced by Hubei Jinwei New Material Co., Ltd, the properties of the produced silica sol in all aspects meet the use requirements of the field of microelectronics, and a new wayis opened up for wide application of domestic silica sol in the field of microelectronics. The mass of the raw material is selected, the used raw material is imported Australian sand, and the metal ion content of the product is reduced from the source.

Description

technical field [0001] The invention relates to the technical field of microelectronics, and more specifically, to the application of a silica sol of Hubei Jinwei New Materials Co., Ltd. in the field of microelectronics. Background technique [0002] For a long time, the silica sol used in the field of microelectronics has relied on imports, and the domestic silica sol cannot meet the production needs of the field of microelectronics due to the limitation of raw materials and processing technology. Take Hubei Jinwei New Material Co., Ltd. as an example. Although it is a large-scale silica sol manufacturer in China, its products are mainly used in various refractory binders, coating industry, thin shell precision casting and paper industry. The performance can not meet the production needs of the microelectronics field. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a kind of application of silica sol produced by Hubei Jinwei New Mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B33/14B01D61/18B01D61/20B65B1/00
CPCC01B33/14B01D61/18B01D61/20B65B1/00
Inventor 王辰伟刘玉岭罗翀周建伟高宝红王如
Owner HEBEI UNIV OF TECH
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