Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Semiconductor device chip mounting device

A patch device and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as irregular placement of semiconductor devices, offset of semiconductor fixed positions, etc., to solve placement errors and improve quality and efficiency, the effect of improving efficiency

Inactive Publication Date: 2021-02-02
陈圆圆
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is that artificial long-time placement is likely to cause irregular placement of semiconductor devices and easy positional deviation for semiconductor fixation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device chip mounting device
  • Semiconductor device chip mounting device
  • Semiconductor device chip mounting device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be constr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of semiconductor devices, particularly to a semiconductor device chip mounting device, which comprises a base, a workbench, two lifting mechanisms, clamping mechanisms, ascending mechanisms, moving mechanisms, a chip mounting moving mechanism and a chip mounting mechanism, wherein the workbench is fixedly arranged above the base, the two lifting mechanisms are symmetrically and fixedly arranged on one side of the workbench, the two clamping mechanisms are fixedly connected with the one lifting mechanisms respectively, the two moving mechanisms are arranged onthe workbench, the four ascending mechanisms are arranged on the workbench, the four lifting mechanisms are symmetrically arranged on one side of the workbench in pairs, the chip mounting moving structure is arranged between the two moving mechanisms, and the chip mounting mechanism is fixedly arranged below the chip mounting moving mechanism. According to the invention, through cooperation of all the components, the problem of position deviation during chip mounting is solved, and the chip mounting efficiency and accuracy are improved.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a semiconductor device patching device. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor material of semiconductor devices is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. [0003] At present, most of the placement of semiconductor devices is handled manually. If the placement operation is carried out manually for a long time, it is very easy to produce large errors, resulting in irregular placement of semiconductor devices. Semiconductor devices are generally fixed ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/67144H01L21/67253H01L21/68721H01L21/68764
Inventor 陈圆圆
Owner 陈圆圆
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com