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Vacuum-printing conductive paste

A conductivity and vacuum technology, applied in the direction of conductive materials, conductive materials, printed circuit components, etc., can solve the problems of slurry viscosity increase, printing performance reduction, solvent volatilization, etc., to maintain printing performance and excellent adhesion , The effect of suppressing the increase in viscosity

Active Publication Date: 2021-01-29
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the case of coating or filling paste on a printed matter such as a substrate by the vacuum printing method, since the atmosphere is a reduced-pressure atmosphere below 50kPa, the solvent in the paste is easy to volatilize.
Therefore, the viscosity of the paste increases and the printing performance decreases

Method used

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  • Vacuum-printing conductive paste
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～15 and comparative example 1～2

[0082] The electroconductive paste for vacuum printing was manufactured by mixing and dispersing each raw material using a three-roll mill so that it might become the compounding ratio shown in following Table 1 and Table 2. The numerical values ​​related to each composition in Table 1 and Table 2 represent parts by mass. The raw materials (each component) used at the time of preparation of the said electroconductive paste are as follows.

[0083] (A) Conductive filler

[0084] (A1) Silver-coated nickel powder (manufactured by NEMIS Corporation, volume average particle diameter D50: 5 μm). The quantity of silver was 10 mass parts with respect to the total of 100 mass parts of silver and nickel powder (purity of nickel: 99.9 mass %) about this silver-coated nickel powder. This silver-coated nickel powder is manufactured by the manufacturing method described in Japanese Patent No. 5764294.

[0085] (A2) Flake silver powder (trade name: FA2, manufactured by DOWA ELECTRONICS Co...

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Abstract

Provided is a vacuum-printing conductive paste as described below. With a vacuum-printing conductive paste according to the present invention, in a reduced-pressure atmosphere during vacuum printing,a solvent is not easily volatilized, and an increase in the viscosity of the conductive paste is suppressed, thus making it possible to maintain favorable printing performance during vacuum printing.Furthermore, during heating and curing, the solvent is sufficiently volatilized, achieving excellent adhesiveness to a printed material. The vacuum-printing conductive paste contains (A) a conductivefiller, (B) a thermosetting resin, (C) a curing agent, and (D) a solvent having a vapor pressure of 0.8-15 Pa at 20 DEG C.

Description

technical field [0001] The present invention relates to a conductive paste for vacuum printing. Background technique [0002] Along with the demand for higher speed and higher functionality of electronic equipment, high-density mounting of electronic devices is also required. As a technique for realizing high-density packaging, the following three-dimensional mounting technique for stacking a plurality of substrates has been developed. In this technique, minute grooves and through-holes are provided on a substrate, and electrodes and wiring are provided in the grooves and through-holes. [0003] A conductive paste containing a conductive material and a resin is filled and cured into minute grooves and through-holes of a substrate used for electronic components. On the other hand, it is not preferable to leave voids in the cured product from the viewpoint of the reliability of electronic devices. Then, in order to reduce voids in the conductive paste filled in the minute g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22C09D11/52H01B1/00H05K1/09H05K3/12
CPCH05K3/12C09D11/52H05K1/09H01B1/22H01B1/00C08K3/08
Inventor 高桥友之津布乐博信坂井德幸阿部真一
Owner NAMICS CORPORATION
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