Fixed clamping anti-collision backplane

A technology for fixing cards and backplanes, which is applied in the direction of instruments, electronic digital data processing, digital data processing parts, etc., can solve the problems of low installation and fixability, simple backplane structure, and inability to protect the backplane, etc., to achieve good Protection, prolonging service life, and easy access

Pending Publication Date: 2021-01-29
湖南锘达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a fixed and clamped anti-collision backboard to solve the technical problems in the prior art that the backboard structure is simple, the installation and fixability are low, and the backboard cannot be protected when the backboard is hit.

Method used

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  • Fixed clamping anti-collision backplane
  • Fixed clamping anti-collision backplane
  • Fixed clamping anti-collision backplane

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Embodiment Construction

[0021] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them.

[0022] The components of the embodiments of the invention generally described and shown in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention.

[0023] Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] In the description of the present invention, it should be noted that the...

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PUM

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Abstract

The invention discloses a fixed clamping anti-collision backplane, and relates to the technical field of computer backplanes. The fixed clamping anti-collision backplane comprises a computer mainboardbackplane, a mounting device, an anti-collision device, a clamping device and a storage connecting device, wherein the computer mainboard backplane is horizontally arranged; the mounting device is arranged on the computer mainboard backplane; the anti-collision device is arranged at the side end of an arc-shaped corner of the computer mainboard backplane; the clamping device is arranged above thecomputer mainboard backplane; and a storage connecting device is arranged on the computer mainboard backplane. According to the fixed clamping anti-collision backplane, deformation of the mainboard can be prevented through the computer mainboard backplane, meanwhile, the heat dissipation performance is considered, through the mounting device, the effects of facilitating installation, taking and placing by hands and fixing and preventing falling can be achieved, shrinkage during machining can be prevented, the anti-collision device can protect the computer mainboard backplane and prevent the computer mainboard backplane from being damaged during collision, so that the computer mainboard can be better protected, and small chips and parts can be stored through the clamping device.

Description

technical field [0001] The invention relates to the technical field of computer backboards, in particular to a fixed and clamped anti-collision backboard. Background technique [0002] The backplane of the mainboard did not exist at the beginning. The older mainboards in the past almost never had this design. It may only be seen on some mid-to-high-end products at that time, and it is more likely that there will be a fixing device on the radiator. . However, since entering the LGA775, the design of the backplane of the motherboard has become popular. A large part of the reason is that with the increase of the heat generation of the CPU and the need for overclocking of the CPU, in order to enhance the heat dissipation performance, the radiator is made larger and larger. Even using pure copper design, which makes the weight of the radiator far beyond the load. The backplane, also known as the anti-deformation backplane, is located on the back of the CPU base and undertakes t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
CPCG06F1/184
Inventor 张礼华
Owner 湖南锘达科技有限公司
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