Wireless charging coil plate surface cover film laminating method

A surface coverage and wireless charging technology, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as poor sol, ultra-thin cover film bonding offset, etc., to reduce the problem of expansion and shrinkage offset, improve Accuracy and the effect of reducing the deviation of fit and alignment

Inactive Publication Date: 2020-12-11
江西一诺新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a method for laminating the covering film on the surface of the wireless charging coil plate, which improves the laminating accuracy of the covering film and solves the problems of lamination deviation and poor sol of the ultra-thin covering film

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  • Wireless charging coil plate surface cover film laminating method

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Embodiment Construction

[0030] Below in conjunction with accompanying drawing, the present invention is described in detail.

[0031] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0032] A method for bonding a covering film on the surface of a wireless charging coil board, especially a bonding and pressing technology for dense circuits with an ultra-thin covering film, specifically comprising the following steps:

[0033] 1) Material preparation: Prepare the flexible copper foil substrate to be filmed and the cover film of the corresponding size. The cover film includes a PI layer and an AD layer; the AD layer is an adhesive layer that will be attached to the base copper of...

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Abstract

The invention discloses a wireless charging coil plate surface cover film laminating method, which comprises the following steps: 1) material preparation: preparing a soft copper foil substrate to belaminated with a film and a cover film with a corresponding size, wherein the cover film comprises a PI layer and an AD layer; 2) cover film glue distribution: performing cold-pressing on a layer of transparent bearing film ion the cover film PI layer; 3) cover film windowing: punching and windowing the cover film and the bearing film together through a die; 4) laminating a cover film: taking downthe cover film, removing the release paper on the cover film, sleeving the PIN, and carrying out alignment lamination; 5) cover film cold pressing: performing vacuum cold pressing on the cover film;6) cover film hot pressing: performing hot pressing on the cover film; and 7) cover film curing: tearing off the transparent bearing film on the surface of the PI layer of the cover film, and baking and curing to obtain a semi-finished FPC board. The laminating precision of the cover film is improved, and the problems of laminating deviation and poor sol of the ultrathin cover film are solved.

Description

technical field [0001] The invention relates to a bonding process of an FPC covering film, in particular to a bonding method of a covering film on the surface of a wireless charging coil board. Background technique [0002] The printed circuit board is the carrier of electronic devices and an essential part of an electronic product or electrical equipment. At present, with the development of electronics and electrical technology, people have higher and higher requirements for printed circuit boards. Currently, the surface of the wireless charging coil board is covered with a film. For the cover film on the surface of the wireless charging coil board, the current process is to punch the window directly after the cover film is supplied, then remove the cover film to remove the release paper, set the PIN in alignment and attach it to the FPC surface, and finally carry out hot pressing and baking The way to cure on the FPC surface. [0003] However, the above-mentioned film s...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/00
Inventor 郑旋陈世彦
Owner 江西一诺新材料有限公司
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