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A polishing process for the channel opening of the back plate in a molybdenum-niobium target assembly

A process and target material technology, which is applied in the field of polishing, can solve the problems of unstable polishing and reduced service life of water outlets, and achieve the effects of improved one-time pass rate, extended service life and stable polishing

Active Publication Date: 2022-05-17
合肥江丰电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the prior art, when the water channel is processed, there are problems such as unstable polishing, and the service life of the water channel is reduced after polishing.

Method used

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  • A polishing process for the channel opening of the back plate in a molybdenum-niobium target assembly

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] This embodiment provides a polishing process for the water channel opening of the back plate in the molybdenum-niobium target assembly, the polishing process includes using an umbrella-shaped polishing brush ( figure 1 ) for polishing;

[0040] The rotation mode of polishing brush in described polishing is clockwise;

[0041] The rotating speed of polishing brush in described polishing is 0.9m / s;

[0042] The polishing time is 17s, and the polishing depth is 0.04mm;

[0043] The umbrella-shaped polishing brush comprises a rounded truncated polishing surface and a belt-shaped polishing surface distributed around it, and the polishing wire length of the polishing brush is 20mm;

[0044] The included angle between the rounded truncated side and the horizontal plane is 85°, and the diameter of the bottom surface of the rounded truncated polished surface is 1.5cm;

[0045] The width of the strip-shaped polishing surface is 0.4mm;

[0046] The polishing wires in the belt-sh...

Embodiment 2

[0049] This embodiment provides a polishing process for the water channel opening of the back plate in the molybdenum-niobium target assembly, the polishing process includes polishing the water channel opening of the back plate in the molybdenum-niobium target assembly with an umbrella-shaped polishing brush;

[0050] The rotation mode of polishing brush in described polishing is clockwise;

[0051] The rotating speed of the polishing brush in the polishing in the polishing is 0.8m / s;

[0052] The polishing time is 20s, and the polishing depth is 0.35mm;

[0053] The umbrella-shaped polishing brush comprises a rounded truncated polishing surface and a belt-shaped polishing surface distributed around it, and the length of the polishing wire of the polishing brush is 15mm;

[0054] The included angle between the rounded truncated side and the horizontal plane is 88°, and the diameter of the bottom surface of the rounded truncated polished surface is 3cm;

[0055] The width of ...

Embodiment 3

[0059] This embodiment provides a polishing process for the water channel opening of the back plate in the molybdenum-niobium target assembly, the polishing process includes polishing the water channel opening of the back plate in the molybdenum-niobium target assembly with an umbrella-shaped polishing brush;

[0060] The rotation mode of the polishing brush in the polishing is clockwise;

[0061] The rotating speed of the polishing brush in the polishing in the polishing is 1m / s;

[0062] The polishing time is 15s, and the polishing depth is 0.045mm;

[0063] The umbrella-shaped polishing brush comprises a rounded truncated polishing surface and a belt-shaped polishing surface distributed around it, and the length of the polishing wire of the polishing brush is 17mm;

[0064] The included angle between the rounded truncated side and the horizontal plane is 86°, and the diameter of the bottom surface of the rounded truncated polished surface is 1.8cm;

[0065] The width of t...

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Abstract

The invention relates to a polishing process for the water channel opening of the back plate in the molybdenum-niobium target assembly, the polishing process includes polishing the water channel opening of the back plate in the molybdenum-niobium target assembly; the polishing is carried out by using an umbrella-shaped polishing brush Polishing; the rotation direction of the polishing brush in the polishing is clockwise; the umbrella-shaped polishing brush includes a rounded truncated polishing surface and a band-shaped polishing surface distributed around it; the angle between the rounded truncated side and the horizontal plane It is 85-88 °, and the diameter of the bottom surface of the rounded frustum-shaped polishing surface is 1.5-3cm; the width of the strip-shaped polishing surface is 0.2-0.5mm; the polishing wires are radially distributed in the strip-shaped polishing surface, and the distribution range is 0 ‑45°, relative to the horizontal plane. The invention makes the polishing stable through the specific selection of the polishing process and the polishing medium, and prolongs the service life of the water channel mouth after polishing.

Description

technical field [0001] The invention relates to the field of polishing, in particular to a polishing process for a water outlet of a back plate in a molybdenum-niobium target assembly. Background technique [0002] The target assembly consists of a target and a backing plate that matches its material, and the backing plate is usually provided with a cooling pipeline to reduce the temperature of the target during the common target sputtering process. [0003] CN107717024A discloses a manufacturing method of a back plate and a target assembly. The manufacturing method includes: providing a back plate blank, the back plate blank includes a welding surface and a back surface opposite to the welding surface; Rough machining, forming an initial water channel in the back surface; finishing the initial water channel to form a water channel structure; during the finishing process, using a volatile solution as a cooling liquid. In the process of finishing the initial waterway, a vola...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/00B24B29/00
CPCB24B29/005B24B1/00
Inventor 姚力军窦兴贤王学泽王青松刘明健
Owner 合肥江丰电子材料有限公司
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