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Chip temperature control equipment

A technology for temperature control equipment and chips, applied in electronic circuit testing, measuring devices, instruments, etc., can solve the problems of high chip heat, chip scrap, low chip test efficiency and test accuracy, etc., to avoid scrap, improve test efficiency, The effect of improving measurement accuracy and consistency

Pending Publication Date: 2020-11-17
WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned technical defects and application requirements, an embodiment of the present invention provides a chip temperature control device to solve the problem that the laser test device in the prior art has a low degree of automation and requires many manual operations, resulting in low chip test efficiency and test accuracy. And the problem that the chip is prone to high heat during the test process, which leads to the scrapping of the chip

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Embodiment Construction

[0046] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0047] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected o...

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Abstract

The invention relates to the technical field of chip testing, and discloses chip temperature control equipment, which comprises a test positioning mechanism, a power-up mechanism, a water injection mechanism and a temperature control mechanism which are arranged on a test bench; the power-up mechanism is located at one side of the test positioning mechanism and is used for powering up a chip on the test positioning mechanism; the temperature control mechanism is located on the test positioning mechanism and is used for carrying out temperature control on the chip on the test positioning mechanism; and the water injection mechanism is connected with the test positioning mechanism and is used for carrying out rapid heat dissipation and cooling on the chip located on the test positioning mechanism. According to the chip temperature control equipment provided by the invention, the temperature control mechanism is used for carrying out temperature control on the chip under test, and the water injection mechanism is used for carrying out rapid heat dissipation and cooling treatment on the chip under test, so that the situation that the chip is scrapped due to overheating is avoided to acertain extent.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip temperature control device. Background technique [0002] Chips are widely used in mobile terminals, computer equipment, face recognition, smart home, aerospace and other fields. In the process of chip development and use, it is generally necessary to test multiple parameters of the chip (such as beam divergence angle, optical power, current, voltage, etc.) to determine whether the performance and working status of the chip meet the requirements. [0003] Existing chip testing devices have a low degree of automation, and most of the testing operations need to be completed manually. Manual operation needs to configure corresponding test tooling for different types of chips, which not only has low test efficiency, consumes manpower and material resources, but also has various problems. Moreover, in the process of testing high-power chips, the chips will generate high ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R31/303G01M11/02
CPCG01R31/2879G01R31/2893G01R31/2874G01R31/303G01M11/02
Inventor 彭琪施小磊宋克江宋周周闫大鹏
Owner WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
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